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[资料] Flip chip Bonding介绍 ...2 3 4 5 6..21	walking001 2015-10-9	20541227	leon_strive 2025-1-3 09:40
[资料] G R&R 中文培训_简单易懂ong	LiuBrian_2024 2024-3-15	81013	leon_strive 2025-1-3 09:31
[原创] memory introduction---IEDM2012 ...2 3 4	lgy635 2014-1-11	369157	leon_strive 2025-1-3 09:30
[资料] Nanofabrication, 3rd ed @2024 ...2	2046 2024-12-2	171227	leon_strive 2025-1-3 09:20
[资料] 集成电路英文书籍和文献个人全集	一如既往客 2023-3-14	81910	leon_strive 2025-1-2 21:39
[资料] IC芯片封装测试制程原理及流程 ...2 3 4	wolfmike2020 2022-3-6	346493	leon_strive 2025-1-2 17:19
[资料] [资料分享]3D Microelectronic Packaging From Architectures to Applications_2021 ...2 3	Zenor 2024-5-6	201724	leon_strive 2025-1-2 15:43
[资料] 腐蚀电化学原理（第三版）曹楚南 ...2	exin29 2020-4-18	133783	leon_strive 2025-1-2 13:15
[资料] 纳米封装——纳米技术与电子封装 ...2	murphyyang 2022-9-6	152725	leon_strive 2025-1-1 21:47
[资料] Wafer-Level Chip-Scale Packaging	一如既往客 2023-3-12	91656	Peter_Gym 2025-1-1 19:09
[求助] 求Springer书籍: Semiconductor Product Engineering, Quality and Operations	free2bird 2025-1-1	0279	free2bird 2025-1-1 17:03
[原创] 光刻模拟光刻仿真 EUV DUV	AdvSim 2024-6-4	2585	419593821 2025-1-1 14:46
[资料] 微电子封装技术(经典) ...2 3 4 5 6..21	alert01 2011-5-4	20846707	leon_strive 2025-1-1 11:51
[原创] 《集成电路芯片封装技术》李可为 ...2 3 4 5 6..12	咸蛋999 2022-5-18	11011423	leon_strive 2025-1-1 11:50
[资料] 关于SRAM的两个论文，感觉还不错 ...2	袁野1990 2019-3-21	175727	leon_strive 2024-12-31 18:03
[原创] 微电子与先进封装技术路线图2023 V4 ...2	dannyyip 2024-10-23	161312	leon_strive 2024-12-31 11:28
[求助] 史蒂文沃尔德的《ESD:物理与器件》中译本 - [已解决]	不吃细糠的山猪 2024-8-2	8776	opqfeixue122 2024-12-30 16:55
[求助] 求取SMIC 14nm工艺库	ihdap7 2024-5-30	81296	STGN 2024-12-30 13:49
[资料] Silicon Devices: Structures and Processing ...2 3 4 5	xinlianxin 2016-9-12	4210985	xdrxdr 2024-12-30 02:08
[资料] Nano-CMOS gate dielectric engineering ...2	芯芯还是芯芯 2019-12-14	123142	xdrxdr 2024-12-30 02:04
[资料] 固体物理系列丛书 ...2	Alielie 2024-1-24	131523	品博锦取_2021 2024-12-27 10:56
[求助] [求书]Semiconductor Advanced Packaging - [已解决] ...2	zen0r 2023-1-8	112168	tietieyu 2024-12-27 10:45
[求助] 悬赏 300信芯片制造第五版和GaN transistors for efficient power conversion wiley - [悬赏 1 信元资产]	313949724 2022-4-1	12157	313949724 2024-12-25 12:36
[资料] 半导体材料测试与分析	AJ1357 2024-12-21	2381	品博锦取_2021 2024-12-24 10:59
[资料] SEMICONDUCTOR MATERIAL AND DEVICE CHARACTERIZATION ...2 3 4 5	semiclxue 2011-3-27	419698	313949724 2024-12-17 09:09
[资料] 美国半导体工艺课件，全！(Introduction to Semiconductor Manufacturing Technology) ...2 3 4 5 6..15	iccastro 2012-2-17	14636021	bubblue 2024-12-16 12:58
[资料] 国内外半半导体标准汇编 ...2 3 4 5	exin29 2020-4-18	478072	freeman0325 2024-12-16 12:38
[求助] 求助Mixmode的资料	IC好难学 2024-12-16	0242	IC好难学 2024-12-16 10:05
[资料] 《半导体制造工艺基础》 ...2	一如既往客 2023-3-12	183096	313949724 2024-12-15 21:38
[资料] semiconductor device fundamentals,半导体器件基础，真正原版 ...2 3 4 5 6..16	godfather777 2011-7-22	15141422	freeman0325 2024-12-15 14:14
[资料] 从0.1nm到1mm：显微测量仪测量抛光至粗糙表面	szzhongtu6 2024-5-27	1770	zxg1992 2024-12-12 15:30
[资料] IC封装术语 ...2 3 4	sannyyan01 2014-2-21	308301	dmf336 2024-12-10 11:22
[资料] SPC 中文-257页完整培训资料 ...2	LiuBrian_2024 2024-3-15	151776	xiaopeng123 2024-12-3 13:46
[资料] Sentaurus Process Explorer 2024.03 用户指导手册	建模小生 2024-7-27	4962	tiantianstudy 2024-12-2 21:18
[求助] 求《handbook of wafer bonding》这本书，谢谢！ - [悬赏 10 信元资产]	wgz000 2024-11-27	4667	wgz000 2024-12-2 18:16