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生产/封装资料区 今日: 0|主题: 1205|排名: 41 

版主: lzd, icfbicfb, u12u34
[资料] BGA Breakouts and Routing - Second Edition attachment  ...2 hungkuochiang 2013-10-15 176675 leon_strive 2025-2-8 09:45
[资料] 晶圆封装技术 新人帖 attachment  ...23 linleer0307 2020-3-17 226408 leon_strive 2025-2-8 09:43
[资料] Berkeley EE243 Advanced IC Processing and Layout - [阅读权限 10]attachment  ...2 J_YL 2021-12-23 13631 leon_strive 2025-2-7 10:16
[资料] Fan-Out Wafer-Level Packaging by John H. Lau (z-lib.org) 新人帖 attachment  ...2 getooo 2021-8-30 195986 chimo2000 2025-2-6 09:07
[求助] 哪位大神有余诗孟教授的《半导体存储器件与电路》 Michael2023 2025-2-4 01507 Michael2023 2025-2-4 22:54
[资料] Design for Excellence in Electronics Manufacturing @2021 attach_img  ...2 2046 2022-10-26 132276 leon_strive 2025-1-27 10:30
[资料] The Circuit Designer’s Companion attachment Huangshu 2023-5-22 81595 leon_strive 2025-1-27 10:27
[资料] 带隙基准设计经典分析bandgap attachment  ...23456..12 你是我的人 2011-7-12 11332781 leon_strive 2025-1-27 10:24
[资料] cadence中的hspice的经典教材资料 attachment  ...23456..13 你是我的人 2011-7-14 12929641 leon_strive 2025-1-27 10:23
[资料] 半导体数值分析 attachment  ...23456 大官人 2015-5-14 5813919 leon_strive 2025-1-27 09:55
[资料] 现代集成电路半导体器件 attachment  ...23 baoshan 2023-12-21 283137 gzliuwj 2025-1-24 14:51
[资料] 半导体工艺---CMP attachment  ...2 temp15555 2015-1-2 187127 yantao052 2025-1-23 14:20
[转贴] Microelectronics Failure Analysis 6 edition , 2011 attach_img  ...23456..19 Jason.tschen 2012-4-6 18039725 omnik 2025-1-23 11:02
[资料] sony semiconductor attachment  ...2 charlesby 2013-6-12 144609 yantao052 2025-1-23 09:08
[资料] CMOS process flow attach_img  ...2 Alielie 2024-1-24 141966 yantao052 2025-1-22 15:00
[资料] 《The electronic packaging handbook》封装专题的书 attach_img  ...23456..11 d8848c 2016-9-29 10526478 leon_strive 2025-1-22 11:33
[资料] Yole seminar先进封装发展趋势分析PPT attachment agree  ...2345 sonthy 2017-3-27 4913576 leon_strive 2025-1-22 11:31
[资料] 芯片微纳制造技术-芯片制造原理与技术 新人帖 attachment  ...23 wolfmike2020 2022-3-5 214387 hijackerhaha 2025-1-22 09:53
[求助] 求助一篇BCD工艺的资料 mimmimhu 2024-8-4 6980 mimmimhu 2025-1-22 09:46
[资料] Production Planning and Control in Semiconductor Manufacturing @2023 attach_img  ...2 2046 2022-12-1 132204 Peter_Gym 2025-1-21 20:50
[资料] 90nm-45nm工艺培训教程 attachment  ...23456 fgwh406 2013-5-1 5623786 Peter_Gym 2025-1-21 20:49
[资料] The basic soldering guide handbook attachment  ...2 一如既往客 2023-3-12 132223 chq_yanxue 2025-1-21 19:26
[资料] 【电子书】nanometer CMOS ICs attachment  ...23456..7 gellmann 2014-8-21 6715453 leon_strive 2025-1-21 15:09
[资料] 超声波热压键合 attachment ghost08 2012-4-2 22887 shengzhou 2025-1-21 14:20
[资料] TSMC Packaging Technologies for Chiplets and 3D_0819 publish_public 新人帖 attachment zijinlin 2024-11-26 6846 shengzhou 2025-1-21 14:16
[资料] 电子工程师自学速成(入门,设计,提高三本) attachment  ...23 一如既往客 2023-3-14 273996 flyskyseu 2025-1-21 11:13
[资料] 多图光刻 attachment  ...2 间一 2014-3-21 123976 leon_strive 2025-1-21 11:08
[资料] 2015华虹宏力技术论坛资料 attachment  ...23 kingo5558 2016-1-29 268688 leon_strive 2025-1-21 11:03
[原创] 2012 Spinger New Book: 3D TCAD Simulation attachment  ...2345 castlerock 2013-7-3 4313857 leon_strive 2025-1-21 11:00
[资料] 华东师范大学-半导体器件原理与仿真设计PPT attach_img  ...2 Alielie 2024-1-24 111640 leon_strive 2025-1-20 13:36
[资料] Complementary Metal Oxide Semiconductor (2018) 一本较新的CMOS工艺相关书籍 新人帖 - [阅读权限 10]attachment  ...23 J_YL 2021-12-22 25642 leon_strive 2025-1-20 13:27
[资料] Semiconductor_Manufacturing_Overview.pdf attach_img  ...2 Zhangzx 2012-12-16 175528 leon_strive 2025-1-20 13:25
[原创] 基于Silvaco的半导体工艺与器件仿真傻瓜教程—张林—长安大学 attachment  ...2 wuende 2020-4-14 186593 ChenFeng1000 2025-1-20 10:54
[资料] Practical Guide to the Packaging of Electronics Thermal and Mechanical Design and Analysis, Third Edition 新人帖 attachment conan719 2022-11-2 81808 leon_strive 2025-1-20 10:50
[资料] silvaco MOSFET 模拟实例(中文)PPT+集成电路工艺原理试题 attachment  ...23456..16 ysuren 2011-5-3 15733654 leon_strive 2025-1-20 10:48
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