EETOP 创芯网论坛 (原名：电子顶级开发网)»论坛 › IC 设计及制造（半导体、微电子）› 集成电路生产/封装/工艺› 生产/封装资料区

生产/封装资料区今日: 1 |主题: 1227|排名: 48

1 ... 3 4 5 6 789 10 11 12 ... 36 / 36 页下一页

新窗全部主题最新热门热帖精华更多		作者	回复/查看	最后发表


[资料] Metal-semiconductor contacts (Rhoderick E.H., Williams R.H.) (z-lib.org).pdf	murphyyang 2022-7-31	82148	313949724 2025-2-8 13:20
[资料] BGA Breakouts and Routing - Second Edition ...2	hungkuochiang 2013-10-15	177403	leon_strive 2025-2-8 09:45
[资料] 晶圆封装技术 ...2 3	linleer0307 2020-3-17	227118	leon_strive 2025-2-8 09:43
[资料] Berkeley EE243 Advanced IC Processing and Layout - [阅读权限 10] ...2	J_YL 2021-12-23	13641	leon_strive 2025-2-7 10:16
[资料] Fan-Out Wafer-Level Packaging by John H. Lau (z-lib.org) ...2	getooo 2021-8-30	196493	chimo2000 2025-2-6 09:07
[求助] 哪位大神有余诗孟教授的《半导体存储器件与电路》	Michael2023 2025-2-4	01743	Michael2023 2025-2-4 22:54
[资料] Design for Excellence in Electronics Manufacturing @2021 ...2	2046 2022-10-26	132775	leon_strive 2025-1-27 10:30
[资料] The Circuit Designer’s Companion	Huangshu 2023-5-22	81931	leon_strive 2025-1-27 10:27
[资料] cadence中的hspice的经典教材资料 ...2 3 4 5 6..13	你是我的人 2011-7-14	12932643	leon_strive 2025-1-27 10:23
[资料] 半导体数值分析 ...2 3 4 5 6	大官人 2015-5-14	5815475	leon_strive 2025-1-27 09:55
[资料] 半导体工艺---CMP ...2	temp15555 2015-1-2	187724	yantao052 2025-1-23 14:20
[资料] sony semiconductor ...2	charlesby 2013-6-12	145045	yantao052 2025-1-23 09:08
[资料] CMOS process flow ...2	Alielie 2024-1-24	142466	yantao052 2025-1-22 15:00
[资料] 《The electronic packaging handbook》封装专题的书 ...2 3 4 5 6..11	d8848c 2016-9-29	10528691	leon_strive 2025-1-22 11:33
[资料] Yole seminar先进封装发展趋势分析PPT ...2 3 4 5	sonthy 2017-3-27	4914647	leon_strive 2025-1-22 11:31
[求助] 求助一篇BCD工艺的资料	mimmimhu 2024-8-4	61294	mimmimhu 2025-1-22 09:46
[资料] Production Planning and Control in Semiconductor Manufacturing @2023 ...2	2046 2022-12-1	132667	Peter_Gym 2025-1-21 20:50
[资料] 90nm-45nm工艺培训教程 ...2 3 4 5 6	fgwh406 2013-5-1	5625228	Peter_Gym 2025-1-21 20:49
[资料] The basic soldering guide handbook ...2	一如既往客 2023-3-12	132632	chq_yanxue 2025-1-21 19:26
[资料] 【电子书】nanometer CMOS ICs ...2 3 4 5 6..7	gellmann 2014-8-21	6716820	leon_strive 2025-1-21 15:09
[资料] 超声波热压键合	ghost08 2012-4-2	23141	shengzhou 2025-1-21 14:20
[资料] TSMC Packaging Technologies for Chiplets and 3D_0819 publish_public	zijinlin 2024-11-26	61241	shengzhou 2025-1-21 14:16
[资料] 多图光刻 ...2	间一 2014-3-21	124424	leon_strive 2025-1-21 11:08
[资料] 2015华虹宏力技术论坛资料 ...2 3	kingo5558 2016-1-29	269304	leon_strive 2025-1-21 11:03
[原创] 2012 Spinger New Book： 3D TCAD Simulation ...2 3 4 5	castlerock 2013-7-3	4314833	leon_strive 2025-1-21 11:00
[资料] 华东师范大学-半导体器件原理与仿真设计PPT ...2	Alielie 2024-1-24	112059	leon_strive 2025-1-20 13:36
[资料] Complementary Metal Oxide Semiconductor (2018) 一本较新的CMOS工艺相关书籍 - [阅读权限 10] ...2 3	J_YL 2021-12-22	25647	leon_strive 2025-1-20 13:27
[原创] 基于Silvaco的半导体工艺与器件仿真傻瓜教程—张林—长安大学 ...2	wuende 2020-4-14	187123	ChenFeng1000 2025-1-20 10:54
[资料] Practical Guide to the Packaging of Electronics Thermal and Mechanical Design and Analysis, Third Edition	conan719 2022-11-2	82066	leon_strive 2025-1-20 10:50
[资料] ebook_Principles of Microelectromechanical Systems ...2 3	lodestar6666 2011-5-2	237840	leon_strive 2025-1-17 18:31
[资料] Advances in Chemical Mechanical Planarization @2016	2046 2022-11-11	82177	leon_strive 2025-1-17 18:30
[资料] Euv Lithography (Vivek Bakshi) (z-lib.org)	murphyyang 2022-7-31	72052	leon_strive 2025-1-17 18:28
[资料] Semiconductor Manufacturing Handbook (Hwaiyu Geng) (z-lib.org) ...2	murphyyang 2022-7-31	102453	313949724 2025-1-16 21:44
[资料] Reliability and Failure of Electronic Materials and Devices ...2 3 4 5 6..9	namixiaoxin 2014-3-8	8422752	313949724 2025-1-16 21:31
[资料] 复旦大学微电子工艺教案，超级经典PPT ...2 3 4 5 6..15	ysuren 2011-5-3	14441975	Aries_F 2025-1-16 16:59

1 ... 3 4 5 6 789 10 11 12 ... 36 / 36 页下一页

返回发新帖

账号		自动登录	找回密码
密码			注册

生产/封装资料区今日: 1 |主题: 1227|排名: 48

快速发帖

浏览过的版块

站长推荐 /1

生产/封装资料区 今日: 1 |主题: 1227|排名: 48

快速发帖

浏览过的版块

站长推荐 /1

生产/封装资料区今日: 1 |主题: 1227|排名: 48