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生产/封装资料区 今日: 1 |主题: 1227|排名: 48 

版主: lzd, icfbicfb, u12u34
[资料] Metal-semiconductor contacts (Rhoderick E.H., Williams R.H.) (z-lib.org).pdf murphyyang 2022-7-31 82148 313949724 2025-2-8 13:20
[资料] BGA Breakouts and Routing - Second Edition  ...2 hungkuochiang 2013-10-15 177403 leon_strive 2025-2-8 09:45
[资料] 晶圆封装技术 新人帖  ...23 linleer0307 2020-3-17 227118 leon_strive 2025-2-8 09:43
[资料] Berkeley EE243 Advanced IC Processing and Layout - [阅读权限 10]  ...2 J_YL 2021-12-23 13641 leon_strive 2025-2-7 10:16
[资料] Fan-Out Wafer-Level Packaging by John H. Lau (z-lib.org) 新人帖  ...2 getooo 2021-8-30 196493 chimo2000 2025-2-6 09:07
[求助] 哪位大神有余诗孟教授的《半导体存储器件与电路》 Michael2023 2025-2-4 01743 Michael2023 2025-2-4 22:54
[资料] Design for Excellence in Electronics Manufacturing @2021  ...2 2046 2022-10-26 132775 leon_strive 2025-1-27 10:30
[资料] The Circuit Designer’s Companion Huangshu 2023-5-22 81931 leon_strive 2025-1-27 10:27
[资料] cadence中的hspice的经典教材资料  ...23456..13 你是我的人 2011-7-14 12932643 leon_strive 2025-1-27 10:23
[资料] 半导体数值分析  ...23456 大官人 2015-5-14 5815475 leon_strive 2025-1-27 09:55
[资料] 半导体工艺---CMP  ...2 temp15555 2015-1-2 187724 yantao052 2025-1-23 14:20
[资料] sony semiconductor  ...2 charlesby 2013-6-12 145045 yantao052 2025-1-23 09:08
[资料] CMOS process flow  ...2 Alielie 2024-1-24 142466 yantao052 2025-1-22 15:00
[资料] 《The electronic packaging handbook》封装专题的书  ...23456..11 d8848c 2016-9-29 10528691 leon_strive 2025-1-22 11:33
[资料] Yole seminar先进封装发展趋势分析PPT  ...2345 sonthy 2017-3-27 4914647 leon_strive 2025-1-22 11:31
[求助] 求助一篇BCD工艺的资料 mimmimhu 2024-8-4 61294 mimmimhu 2025-1-22 09:46
[资料] Production Planning and Control in Semiconductor Manufacturing @2023  ...2 2046 2022-12-1 132667 Peter_Gym 2025-1-21 20:50
[资料] 90nm-45nm工艺培训教程  ...23456 fgwh406 2013-5-1 5625228 Peter_Gym 2025-1-21 20:49
[资料] The basic soldering guide handbook  ...2 一如既往客 2023-3-12 132632 chq_yanxue 2025-1-21 19:26
[资料] 【电子书】nanometer CMOS ICs  ...23456..7 gellmann 2014-8-21 6716820 leon_strive 2025-1-21 15:09
[资料] 超声波热压键合 ghost08 2012-4-2 23141 shengzhou 2025-1-21 14:20
[资料] TSMC Packaging Technologies for Chiplets and 3D_0819 publish_public 新人帖 zijinlin 2024-11-26 61241 shengzhou 2025-1-21 14:16
[资料] 多图光刻  ...2 间一 2014-3-21 124424 leon_strive 2025-1-21 11:08
[资料] 2015华虹宏力技术论坛资料  ...23 kingo5558 2016-1-29 269304 leon_strive 2025-1-21 11:03
[原创] 2012 Spinger New Book: 3D TCAD Simulation  ...2345 castlerock 2013-7-3 4314833 leon_strive 2025-1-21 11:00
[资料] 华东师范大学-半导体器件原理与仿真设计PPT  ...2 Alielie 2024-1-24 112059 leon_strive 2025-1-20 13:36
[资料] Complementary Metal Oxide Semiconductor (2018) 一本较新的CMOS工艺相关书籍 新人帖 - [阅读权限 10]  ...23 J_YL 2021-12-22 25647 leon_strive 2025-1-20 13:27
[原创] 基于Silvaco的半导体工艺与器件仿真傻瓜教程—张林—长安大学  ...2 wuende 2020-4-14 187123 ChenFeng1000 2025-1-20 10:54
[资料] Practical Guide to the Packaging of Electronics Thermal and Mechanical Design and Analysis, Third Edition 新人帖 conan719 2022-11-2 82066 leon_strive 2025-1-20 10:50
[资料] ebook_Principles of Microelectromechanical Systems  ...23 lodestar6666 2011-5-2 237840 leon_strive 2025-1-17 18:31
[资料] Advances in Chemical Mechanical Planarization @2016 2046 2022-11-11 82177 leon_strive 2025-1-17 18:30
[资料] Euv Lithography (Vivek Bakshi) (z-lib.org) murphyyang 2022-7-31 72052 leon_strive 2025-1-17 18:28
[资料] Semiconductor Manufacturing Handbook (Hwaiyu Geng) (z-lib.org)  ...2 murphyyang 2022-7-31 102453 313949724 2025-1-16 21:44
[资料] Reliability and Failure of Electronic Materials and Devices  ...23456..9 namixiaoxin 2014-3-8 8422752 313949724 2025-1-16 21:31
[资料] 复旦大学微电子工艺教案,超级经典PPT  ...23456..15 ysuren 2011-5-3 14441975 Aries_F 2025-1-16 16:59
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