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1、Job Title: DSPSystem EngineerDepartment: Cellular EngineeringLocation: Shanghai/Nanjing Job Description:Physical Layer System Engineer for3G/GSM UEMarvell Shanghai is now looking for theTD-SCDMA, WCDMA, and GSM physical layer engineers to join us in 3G/2Gproduction. As a worldwide leading fabless semiconductor company, we areworking on 3G/2G communication product and technology. You would join in us inthe design, development, implementation and debug of advanced physical layerfirmware and system for the wireless communication productions. Qualification:- A minimum of Bachelor degree inElectrical Engineering is required with specialization in DSP or communication- Experience in the develop of thephysical layer or L1 Controller of 3G/2G (TD-SCDMA, WCDMA, GSM) are preferred- Related experience in the 3G/2G systemdesign, Dual RAT, HSPA and system testing is a good plus- Strong Digital Signal Processingknowledge in the area of digital communication system and of various digitalmodulation schemes- Good written and oral English skills- Good Team work 2、Job Title: DSP/Firmware EngineerDepartment: Cellular EngineeringLocation: Shanghai/Nanjing Job Description: -We are looking for a DSP/FirmwareEngineer with solid background in digital communication and signal processingto join our system design team for wireless communication system, include2G/3G/4G. -The successful candidate is expected towork in a collaborative team on cutting-edge data communication technologies.Responsibility includes designing algorithm and architecture and implementationfor the physical layer of the modems. -This position also requires closeinteraction with the digital design team on design specification, verificationand test. Qualification: -M.S.or Ph.D in Electrical Engineering -About 3 yrs working experience. -Must have strong knowledge of digitalcommunication and signal processing theory -Proficient in building up communicationsystem simulator with C/C++ and Matlab -Knowledge and experience on thecommunication physical layer are preferred -Familiarity with DSP and RTLimplementation is a good plus. -Good communication skills in spoken andwritten English -Good at collaboration and team work 3、Job Title: DSP Engineer (TD/LTE)Department: Cellular EngineeringLocation: Shanghai/Nanjing Job Description: -We are looking for a DSP/FirmwareEngineer with solid background in digital communication and signal processingto join our system design team for wireless communication system, include2G/3G/4G.-The successful candidate is expected towork in a collaborative team on cutting-edge data communication technologies.Responsibility includes designing algorithm and architecture and implementationfor the physical layer of the modems. -This position also requires closeinteraction with the digital design team on design specification, verificationand test. Qualification:-M.S.or Ph.D in Electrical Engineering -About 3 yrs working experience. -Must have strong knowledge of digitalcommunication and signal processing theory -Proficient in building up communicationsystem simulator with C/C++ and Matlab -Knowledge and experience on the communicationphysical layer are preferred -Familiarity with DSP and RTLimplementation is a good plus. -Good communication skills in spoken andwritten English -Good at collaboration and team work 4、Job Title: DSP/Firmware Audio EngineerDepartment: Cellular EngineeringLocation: Shanghai/Nanjing Job Description: -We are looking for a SeniorDSP/Firmware Engineer with solid background in audio processing to join oursystem design team for wireless communication system, include 2G/3G/4G -Help customer do audio design relatedto the implementation with acoustic components and hardware circuit -Cooperate with customer to definite anddevelop audio DSP block -Instruct customer to implement audiotuning -Support customer to analyze and solveaudio related problems Qualification: -B.Sc. in Signal & informationProcessing Engineering, Electronic Engineering, Telecommunication Engineeringor other relevant major -At least 3 years of relevant workingexperience with emphasis on audio DSP tuning, hardware circuit design -Familiar with mobile phone testStandard -Familiar with acoustic design of audiocomponents -Familiar with architecture applicationof one audio DSP processor -Have the basic knowledge of signalprocess algorithm, such as echo cancellation and so on -Knowledge and experience on thecommunication physical layer are preferred -Good communication skills in spoken andwritten English -Good at collaboration and team work If you are interested in any one of the four positions, please send your resume to the following email address: jiangrr@marvell.comSubject of your email should be: School_Name_Applied position_Information source
Eg.SJTU_Zhang Peng _Data Analyst_BBS |