NO.78-package engineer（Shanghai）

kthr

Responsible for providing total package solution on BGA, QFN, QFP & FCBGA packages
  Responsible forsubstrate design release and electrical / thermal simulation result recognition
  Manage production issues in subcontractors
  Working together with product/test/quality engineers to improve production yield
  Maintain and develop resource to support new prototype samples
  Price negotiation with suppliers
  Other jobs assigned by department supervisor

  M.S. or B.S. degree in engineering
  Over 5 years’ hands on experience at package house or fabless (subcontractor operation)
  Strong background on package development on BGA/QFP/QFN packages
  Experience in package process and yield improvement activities
  Ability on package feasibility study on substrate layout and bond ability check
  Familiar with SIP products
  Good mentoring, communication, presentation skills and team work
  Strong data analysis and technical problem solving skills
Preferred qualification:
  Experience on substrate layout
  Experience on package level electrical simulation
  Ever work background on wire bonding, especially on copper / alloy wires
  Project management or NPI experience

KT Human Resources Consulting Company (Shanghai) was established in 2001 in response to a need for a recruitment consultancy to be an active, contributing member of the semiconductor community, as opposed to simply a supplier to it.We provide professional search and talent acquisition in the Integrated Circuit、Electronic、Telecommunications industry of international corporations in Greater China. Our client list contains numerous international companies, many of them are long-term customers.

If you interested in the job, pls sent your cv to: hr@kthr.com, thanks!
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