|
马上注册,结交更多好友,享用更多功能,让你轻松玩转社区。
您需要 登录 才可以下载或查看,没有账号?注册
x
本帖最后由 Langjity 于 2012-9-15 22:03 编辑
关于EM的一个选择题,如下:Electro-migration (EM) decreases the reliability of ICs. For EM, which of the following statements is right (multiple choice)?
A)
EM is due to the collision of electrons to each other when they are moving in metal.
B)
High temperature will have bad impact for EM.
C)
Aluminum has higher conductivity than Copper, so Aluminum is more electro-migration-robust than Copper.
D)
Doping with some other metallic element (like Cu, Tu), Aluminum metal could build barrier for movement of iron, which is good for EM.
E)
EM may cause metal wire “open” and “short”.
F)
EM problem for power network is more serious than EM problem for normal signal.
哪几项是正确的啊? |
|