Grounding and Shielding: Circuits and Interference, 5th Edition Preface to the Fifth Edition.1. Voltage and Capacitance.
1.1. Introduction.
1.2. Charges and Electrons.
1.3. The Electric Force Field.
1.4. Field Representations.
1.5. The Defi nition of Voltage.
1.6. Equipotential Surfaces.
1.7. The Electric Force Field between Two Conducting Plates.
1.8. Electric Field Patterns.
1.9. The Energy Stored in an Electric Field.
1.10. Dielectrics.
1.11. The D Field.
1.12. Capacitance.
1.13. Mutual Capacitance.
1.14. Displacement Current.
1.15. Energy Stored in a Capacitor.
1.16. Forces in the Electric Field.
1.17. Capacitors. 2. Magnetics.
2.1. Magnetic Fields.
2.2. Biot and Savart’s Law.
2.3. The Solenoid.
2.4. Faraday’s Law and the Induction Field.
2.5. Inductance.
2.6. The Energy Stored in an Inductance.
2.7. Magnetic Field Energy in Space.
2.8. The Magnetic Circuit.
2.9. A Magnetic Circuit with a Gap.
2.10. Small Inductors.
2.11. Self- and Mutual Inductance.
2.12. Transformer Action.
2.13. Hysteresis and Permeability.
2.14. Eddy Currents.
2.15. The Transport of Electrical Energy.
2.16. Poynting’s Vector.
2.17. Transmission Lines Introduction.
2.18. Transmission Line Operations.
2.19. Transmission Line Field Patterns.
2.20. Interfering Fields. 3. Utility Power and Facility Grounding.
3.1. Introduction.
3.2. History.
3.3. Semantics.
3.4. The Earth as a Conductor.
3.5. The Neutral Connection to Earth.
3.6. Ground Potential Differences.
3.7. Field Coupling to Power Conductors.
3.8. Neutral Conductors.
3.9. K-Factor in Transformers.
3.10. Ungrounded Power.
3.11. A Request for Power.
3.12. Earth Power Currents.
3.13. Line Filters.
3.14. Isolated Grounds.
3.15. Facility Grounds—Some More History.
3.16. Lightning.
3.17. Lightning and Facilities. 4. Analog Circuits.
4.1. Introduction.
4.2. Instrumentation.
4.3. History.
4.4. The Basic Shield Enclosure.
4.5. The Enclosure and Utility Power.
4.6. The Two-Ground Problem.
4.7. Instrumentation and the Two-Ground Problem.
4.8. Strain-Gauge Instrumentation.
4.9. The Floating Strain Gauge.
4.10. The Thermocouple.
4.11. The Basic Low-Gain Differential Amplifi er.
4.12. Shielding in Power Transformers.
4.13. Calibration and Interference.
4.14. The Guard Shield above 100 kHz.
4.15. Signal Flow Paths in Analog Circuits.
4.16. Parallel Active Components.
4.17. Feedback Stability—Introduction.
4.18. Feedback Theory.
4.19. Output Loads and Circuit Stability.
4.20. Feedback Around a Power Stage.
4.21. Constant-Current Loops.
4.22. Filters and Aliasing Errors.
4.23. Isolation and DC-to-DC Converters.
4.24. Charge Converter Basics.
4.25. Guard Rings.
4.26. Thermocouple Effects.
4.27. Guard Switching.
4.28. Digital Control. 5. Radiation.
5.1. Handling Radiation and Susceptibility.
5.2. Radiation: What Is It?
5.3. The Dipole Antenna.
5.4. Wave Impedance.
5.5. Field Strength and Antenna Gain.
5.6. Radiation from Loops.
5.7. E-Field Coupling to a Loop.
5.8. A Note on Sine Wave Analysis.
5.9. Approximations for Pulses and Square Waves.
5.10. Radiation from a Printed Circuit Board.
5.11. The Sniffer and the Antenna.
5.12. Solar Magnetic Storms.
5.13. Radiation from the Earth. 6. Hardware.
6.1. Cables with Foil Shields.
6.2. Coaxial Cables.
6.3. Low-Noise Cables.
6.4. Transfer Impedance.
6.5. Wave Guides.
6.6. Electromagnetic Fields Over a Ground Plane.
6.7. Skin Effect.
6.8. Ohms per Square.
6.9. Fields and Conductors.
6.10. Conductive Enclosures—Introduction.
6.11. Coupling through Enclosure Walls by an Induction Field.
6.12. Refl ection and Absorption of Field Energy at a Conducting Surface.
6.13. Independent Apertures.
6.14. Dependent Apertures.
6.15. Honeycombs.
6.16. Summing Field Penetrations.
6.17. Power Line Filters.
6.18. Back Shell Connectors.
6.19. H-Field Coupling.
6.20. Gaskets.
6.21. Finger Stock.
6.22. Glass Apertures.
6.23. Guarding Large Transistors.
6.24. Mounting Components on Surfaces.
6.25. Zappers. 7. Digital Electronics.
7.1. Introduction.
7.2. Circuit Board Material.
7.3. The Two-Sided Circuit Board.
7.4. Multilayer Circuit Boards.
7.5. Ground Planes and Digital Circuit Boards.
7.6. Clocked Logic.
7.7. The Transmission of a Single Logic Signal.
7.8. Decoupling Capacitors.
7.9. The Power Plane.
7.10. The Ground and Power Plane Capacitance.
7.11. Using Vias.
7.12. Decoupling Capacitors as Transmission Lines.
7.13. Characteristic Impedance Control.
7.14. Radiation from Digital Boards.
7.15. Measurement Problems—Ground Bounce.
7.16. High Clock Rates.
7.17. Balanced Transmission.
7.18. Ribbon Cable and Connectors.
7.19. Daughter Boards.
7.20. Mixing Analog and Digital Circuits.
7.21. Optical Isolation.
7.22. Gold Plating.
7.23. GHz Notes. 8. Facility Hardware.
8.1. Ground Planes.
8.2. A Facility Ground Plane Using Stringers.
8.3. Other Ground Planes.
8.4. Ground Planes and Remote Sites.
8.5. Extending Ground Planes.
8.6. Separately Derived Power.
8.7. Surge Protection.
8.8. The Isolation Transformer.
8.9. Screen Rooms.
8.10. Motor Controllers.
8.11. A True Story. References. Index.
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发表于 2008-2-20 00:18:23
发表于 2008-2-20 09:42:57
