求书:Modeling,Analysis Design and Tests for Electronics Packaging beyond Moore,超摩尔时代电子封装建模

liyouzhaohui · 发表于 2023-1-12 11:44:20

可以看看， model分析还行

rfjungle · 发表于 2023-1-31 16:35:13

thanks!!!

ucant · 发表于 2023-2-10 12:56:45

zlhrsy 发表于 2022-8-24 18:43
kankanxian

反对点错了。。。。。。。。。。。

gacheng · 发表于 2023-3-1 19:41:26

Thank you very much!!!

gonethewind · 发表于 2023-3-2 10:40:01

感觉现在的书越来越商业化，干货越来越少。

zen0r · 发表于 2023-3-2 14:51:01

谢谢分享

竹林清风ly · 发表于 2023-3-6 21:38:27

The system-level thermal modeling and design deal with the cooling and temperature control of more than one chip or components.

[求助] 求书:Modeling,Analysis Design and Tests for Electronics Packaging beyond Moore,超摩尔时代电子封装建模