集成电路热管理Thermal and Power Management of Integrated Circuits

Shangkui

推荐一本集成电路热管理方面的书
PrefaceForeword . . . Xlll
Chapter 1. Introduction1. Evolution of CMOS Technology2. Emergence of Thermal Issues3. Motivation of this Book

Chapter 2. Power, Junction Temperature, and Reliability1. Power in Nanometer Regime2. Leakage Reduction Techniques3. Junction Temperature Projectionsfor Deep Sub-micron Technologies4. Reliability Issues in Scaled Technologies5. Summary

Chapter 3. Burn-in as a Reliability Screening Test1. Burn-in2. What is Burn-in?3. Temperature and Voltage Acceleration Factors4. Technology Scaling and Burn-in5. Burn-in Elimination6. Estimation of Junction Temperature Increasewith Technology Scaling under Burn-in Conditions7. Packaging Consideration in Bum-in 8. Cooling Techniques for Burn-in9. Bum-in Limitations and Optimization10. Summary

Chapter 4. Thermal and Electrothermal Modeling1. Objectives of Thermal Analysis2. Thermal Network Modeling3. Architectural Level Electrothermal Modeling4. Electrothermal Modeling at Logic Level5. Electrothermal Modeling at Circuit Level6. Electrothermal Modeling at Device Level7. Static Electrothermal Modeling: A Case Study8. Summary

Chapter 5. Thermal Runaway and Thermal Management1. Thermal Awareness2. Thermal Runaway3. Thermal Runaway During Burn-in4. Thermal Management duringNormal Operating Conditions5. Temperature Management: A Case Study6. Temperature Measurement of Semiconductor Devices7. Summary

Chapter 6. Low Temperature CMOS Operation1. Low Temperature Motivation2. Low Temperature Characterization of CMOS Devices3. Reliability at Low Temperature4. Microprocessor Low Temperature Operation : A Case Study5. Disadvantages of Low Temperature Electronic Cooling6. Cooling Technologies7. Summary

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