Hotchips 2019 论文PPT分类下载

固执的寻觅 · 发表于 2019-9-30 20:47:01

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Hot Chips: A Symposium on High Performance ChipsConference Sponsor IEEE Technical Committee on Microprocessors and Microcomputers.

大家可以按照感兴趣的公司对应的芯片找相关的下载，不需要全部下。
按需供应。

HC31_2.13_AMD_final.pdf (9.53 MB, 下载次数: 87 )

HC31_2.12_NVIDIA_final.pdf (2.15 MB, 下载次数: 74 )

HC31_2.11_Jintide_Server_CPU_final_r6.0.pdf (1.81 MB, 下载次数: 61 )

HC31_2.10_LKF_HC_2019_Final_v7.pdf (5.18 MB, 下载次数: 52 )

HC31_2.9_AyarLabs_20190820_HC_FINAL.pdf (13.59 MB, 下载次数: 104 )

HC31_2.8_HPE.pdf (2.22 MB, 下载次数: 51 )

HC31_2.7_Plenary_2_-_HS_Philip_Wong_-_TSMC_-_What_Will_the_Next_Node_Offer_Us_20.pdf (5.43 MB, 下载次数: 63 )

HC31_2.6_Intel_SPH_2019_v3.pdf (1019.55 KB, 下载次数: 65 )

HC31_2.5_Xilinx_Versal_Hotchips31_Final_v2.pdf (3.27 MB, 下载次数: 76 )

HC31_2.4_Nvidia_HotChips_RC18_final.pdf (1.72 MB, 下载次数: 60 )

HC31_2.3_Tesla_Hotchips_ppt_Final_0817.pdf (2.21 MB, 下载次数: 67 )

HC31_2.2_Ouroboros_Wavenet_Accelerator_v5.0.pdf (1.33 MB, 下载次数: 44 )

HC31_2.1_Cypress_HotChips31-89459-final.pdf (2 MB, 下载次数: 52 )

HC31_Welcome_v4.pdf (2.97 MB, 下载次数: 39 )

Hot_Chips_2019_DrLisaSu_AMD_0819.pdf (7.74 MB, 下载次数: 54 )

HC31_1.14_HabanaLabs.Eitan_Medina.v9.pdf (2.55 MB, 下载次数: 58 )

HC31_1.13_Cerebras.SeanLie.v02.pdf (2.19 MB, 下载次数: 52 )

HC31_1.12_Intel_Intel.AndrewYang.v0.92.pdf (729.06 KB, 下载次数: 58 )

HC31_1.11_Huawei.Davinci.HengLiao_v4.0.pdf (2.62 MB, 下载次数: 99 )

HC31_1.10_MethodologyAndMLSystem-Facebook-rev-d.pdf (763.83 KB, 下载次数: 45 )

HC31_1.9_MethodologyAndMLSystem-MLPerf-rev-b.pdf (1.27 MB, 下载次数: 43 )

HC31_1.8_MethodologyAndMLSystem-Stanford-rev-b.pdf (539.66 KB, 下载次数: 47 )

HC31_1.6_OptaneDCPMM_2019_FinalSlides_v4b.pdf (1.72 MB, 下载次数: 46 )

HC31_1.5_Princeton.HongyangJia.v09.NS.pdf (1.33 MB, 下载次数: 47 )

HC31_1.4_UPMEM.FabriceDevaux.v2_1.pdf (1.01 MB, 下载次数: 51 )

HC31_1.3_IBM.v12.pdf (1.61 MB, 下载次数: 53 )

HC31_1.2_20190816_Arm_Neoverse_N1_CPU.pdf (1.78 MB, 下载次数: 68 )

HC31_1.1_AMD_ZEN2.pdf (19.73 MB, 下载次数: 117 )

固执的寻觅 · 发表于 2019-10-1 08:43:28

HC31_T7_Pulp.pdf (4.34 MB, 下载次数: 37 )

HC31_T6_Rocket.pdf (1.7 MB, 下载次数: 37 )

HC31_T5_Part_II_Overview_of_RISC-V_SW_Ecosystem-3.pdf (3.33 MB, 下载次数: 36 )

HC31_T4_RISCV-20190818-HotChips.pdf (4.04 MB, 下载次数: 49 )

HC31_T3_Cloud_TPU_Codesign.pdf (3.06 MB, 下载次数: 53 )

HC31_T2_Microsoft_CarrieChiouChung.pdf (2.38 MB, 下载次数: 39 )

HC31_T1_AWS_Nitro_Hot_Chips_20190818-2.pdf (1.67 MB, 下载次数: 48 )

Thinker-IM.pdf (950.2 KB, 下载次数: 36 )

ntx_hotchips2019.pdf (405.79 KB, 下载次数: 27 )

HC31.UIUC.ChengLi.v01.pdf (725.54 KB, 下载次数: 29 )

HC31.UCSD.SoroushGhodrati.v01.pdf (3.31 MB, 下载次数: 31 )

HC31.SKTelecom.SeokJoongHwang.v01.pdf (488.29 KB, 下载次数: 25 )

HC31.KULeuven.NimishShah.v01.pdf (384.05 KB, 下载次数: 36 )

HC31.KAIST.JinsuLee.v01.pdf (182.4 KB, 下载次数: 31 )

HC31.GrayResearch.JanGray.v01.pdf (2.32 MB, 下载次数: 35 )

HC31.ChungbukNationalUniversity.SeungbumBaek.v02.pdf (1.78 MB, 下载次数: 25 )

HC31.ChungbukNationalUniversity.DucNhanLe.v02.pdf (588.97 KB, 下载次数: 31 )

Bigstream-Poster-v.2.2.pdf (1.78 MB, 下载次数: 25 )

今年的HOTchips很有意思，大家值得一看啊

smrecnik · 发表于 2019-10-1 17:45:51

Thanks a lot

固执的寻觅 · 发表于 2019-10-2 20:14:16

Sunday, 8/18/2019: Tutorials

8:00 AM – 9:15 AM: Registration / Breakfast
9:15 AM – 12:45 AM: Morning Tutorials: Acceleration in the Cloud
9:15 AM – 10:15 AM: The Nitro Project – Next Generation AWS Infrastructure
10:15 AM – 11:15 AM: Acceleration at Microsoft
11:15 AM – 11:45 AM: Break
11:45 AM – 12:45 PM: TPU V3 in Google Cloud: Architecture and Infrastructure
12:45 PM – 2:00 PM: Lunch
2:00 PM – 5:00 PM: Afternoon Tutorial: RISC-V
5:00 PM – 6:00 PM: Reception

Monday, 8/19/2019: Conference Day 1

7:30 AM – 8:45 AM: Registration / Breakfast (sponsored by Intel)
8:45 AM – 9:00 AM: Opening Remarks
9:00 AM – 10:30 AM: General Purpose Compute
10:30 AM – 11:00 AM: Break (sponsored by Intel)
11:00 AM – 12:30 PM: Memory
12:30 PM – 1:45 PM: Lunch (sponsored by Intel)
1:45 PM – 2:45 PM: Keynote 1: “Delivering the Future of High-Performance Computing with System, Software and Silicon Co-Optimization” by Dr. Lisa Su, CEO, AMD
2:45 PM – 4:15 PM: Methodology and ML Systems
4:15 PM – 4:45 PM: Break (sponsored by Intel)
4:45 PM – 6:45 PM: ML Training
6:45 PM – 7:45 PM: Reception (Wine & Snacks sponsored by Intel)

Tuesday, 8/20/2019: Conference Day 2

8:00 AM – 9:00 AM: Registration / Breakfast (sponsored by Intel)
9:00 AM – 10:30 AM: Embedded and Auto
10:30 AM – 11:00 AM: Break (sponsored by Intel)
11:00 AM – 12:30 PM: ML Inference
12:30 PM – 1:45 PM: Lunch (sponsored by Intel)
1:45 PM – 2:45 PM: Keynote 2: “What Will the Next Node Offer Us?” by Dr. Philip Wong, VP Corporate Research, TSMC
2:45 PM – 3:45 PM: Interconnects
3:45 PM – 4:15 PM: Break (sponsored by Intel)
4:15 PM – 5:15 PM: Packaging and Security
5:15 PM – 6:45 PM: Graphics and AR
6:45 PM – 7:00 PM: Closing Remarks