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楼主: real

VLSI Custom Microelectronics.Digital, Analog, and Mixed-Signal

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发表于 2007-1-24 08:39:16 | 显示全部楼层
Copyright  1999 by Marcel Dekker, Inc. All Rights Reserved.
发表于 2007-1-24 08:40:58 | 显示全部楼层

content

APPENDIX A: The Elements and Their Properties
APPENDIX B: Fabrication and Yield
APPENDIX C: The Principal Equations Relating to Bipolar
Transistor Performance
APPENDIX D: The Principal Equations Relating to Unipolar
(MOS) Transistor Performance
发表于 2007-1-24 08:43:19 | 显示全部楼层

content

1 INTRODUCTION: THE MICROELECTRONICS EVOLUTION
1.1 Initial History
1.2 The Continuing Evolution
1.3 CAD Developments
1.4 Why Custom Microelectronics?
1.5 Summary
1.6 References
2 TECHNOLOGIES AND FABRICATION
2.1 Bipolar Silicon Technologies
2.2 Unipolar Silicon Technologies
2.3 Memory Circuits
2.4 BiCMOS Technology
2.5 Gallium-Arsenide Technology
2.6 A Comparison of Available Technologies
2.7 References
3 STANDARD OFF-THE-SHELF ICs
3.1 Nonprogrammable SSI, MSI and LSI Digital ICs
3.2 Standard Analog ICs
3.3 Microprocessors
3.4 Memory
3.5 Programmable Logic Devices
3.6 Logic Cell Arrays (LCAs)
发表于 2007-1-24 08:44:13 | 显示全部楼层

content

3.7 Specialized Application-Specific Standard Parts (ASSPs)
3.8 Summary
3.9 References
4 CUSTOM MICROELECTRONIC TECHNIQUES
4.1 Full Hand-Crafted Custom Design
4.2 Standard Cell Techniques
4.3 Gate Array Techniques
4.4 Maskless Fabrication Techniques
4.5 Summary and Technical Comparisons
4.6 References
5 COMPUTER-AIDED DESIGN
5.1 IC Design Software
5.2 IC Simulation Software
5.3 Silicon Compilers
5.4 CAD Hardware Availability
5.5 CAD Software Availability
5.6 CAD Costs
5.7 Summary
5.8 References
6 TEST PATTERN GENERATION AND
DESIGN-FOR-TESTABILITY
6.1 Introduction
6.2 Basic Testing Concepts
6.3 Digital Test Pattern Generation
6.4 Test Pattern Generation for Memory and Programmable
Logic Devices
6.5 Microprocessor Testing
6.6 Design-for-Testability (DFT) Techniques
6.7 PLA Design-for-Testability Techniques
6.8 I/O Testing and Boundary Scan
6.9 Further Testing Concepts
6.10 The Silicon Area Overheads of DFT
6.11 Summary
6.12 References
7 THE CHOICE OF DESIGN STYLE: TECHNICAL AND
MANAGERIAL CONSIDERATIONS
7.1 The Microelectronic Choices
7.2 Packaging
7.3 Time to Market
7.4 Financial Considerations
7.5 Summary
7.6 References
8 CONCLUSIONS
8.1 The Present Status
8.2 Future Developments
8.3 Final Summary
8.4 References
发表于 2007-1-24 11:53:02 | 显示全部楼层
t han k s
发表于 2007-1-24 14:54:57 | 显示全部楼层
Please give its content , thanks
发表于 2007-2-12 11:49:10 | 显示全部楼层
thanks for your information
发表于 2007-3-30 22:19:37 | 显示全部楼层

收到。

谢谢楼主。比较全面的书,不错。
发表于 2007-4-7 00:34:34 | 显示全部楼层
thank very much
发表于 2007-4-9 21:13:36 | 显示全部楼层
xiexie
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