io版图器件的布局问题？

enjoy545352 · 发表于 2011-9-11 15:55:53

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画io版图时除ESD器件外，其他器件的布局有没有什么特殊要求？比如说器件的间距，求解答，万分感谢。

snake6269 · 发表于 2011-9-11 16:57:31

DDDDDDDDDDDDDDD

charming_94566 · 发表于 2011-9-12 02:11:35

It depends on what type of IO you're talking.
Wire-bond (inline, stagger...) or flip-chip...? Is it a Bondpad Over Active Circuit (BOAC)?
In general, you want the signal/current from passivation openning go thru ESD first then connect to secondary ESD to input buffer or output driver.
You need to know what type of IO before you start your layout planning.
A lot of IO materials on line you can also search JDEC for more.