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An Introduction to Microelectromechanical Systems Engineering
Intro To MEMS Eng.rar
(1.66 MB, 下载次数: 118 )
Nadim Maluf
Contents
Foreword xiii
Preface xvii
1 MEMS: A Technology from Lilliput 1
The promise of technology 1
What are MEMS—or MST? 3
What is micromachining? 6
Applications and markets 6
To MEMS or not to MEMS? 7
Standards 9
The psychological barrier 10
Journals, conferences, and Web sites 10
List of journals and magazines 11
List of conferences and meetings 12
Summary 13
References 13
vii
2 The Sandbox: Materials for MEMS 15
Silicon material system 16
Silicon 16
Silicon oxide and nitride 23
Thin metal films 23
Polymers 25
Other materials and substrates 25
Glass and quartz substrates 26
Silicon carbide and diamond 26
Gallium arsenide and other group III-V compound
semiconductors 27
Shape-memory alloys 27
Important material properties and physical effects 28
Piezoresistivity 29
Piezoelectricity 31
Thermoelectricity 35
Summary 37
References 37
3 The Toolbox: Processes for Micromachining 41
Basic process tools 42
Epitaxy 43
Oxidation 44
Sputter deposition 44
Evaporation 45
Chemical vapor deposition 46
Spin-on methods 50
Lithography 51
Etching 55
vii An Introduction to Microelectromechanical Systems Engineering
Advanced process tools 70
Anodic bonding 70
Silicon-fusion bonding 71
Grinding, polishing, and chemomechanical polishing (CMP) 72
Sol-gel deposition methods 74
Electroplating and molding 75
Combining the tools—examples of commercial processes 75
Polysilicon surface micromachining 77
Combining silicon fusion bonding with reactive ion etching
(SFB-DRIE) 79
SCREAM 81
Summary 82
References 83
4 The Gearbox: Commercial MEM Structures
and Systems 87
General design methodology 88
Techniques for sensing and actuation 90
Common sensing methods 90
Common actuation methods 91
Passive MEM structures 95
Fluid nozzles 95
Inkjet print nozzles 97
Sensors 99
Pressure sensors 99
High-temperature pressure sensors 104
Mass flow sensors 105
Acceleration sensors 108
Angular rate sensors and gyroscopes 119
Radiation sensors—infrared imager 134
Contents viii
Carbon monoxide gas sensor 136
Micromachined microphone 138
Actuators 142
Digital Micromirror DeviceTM 142
Micromachined valves 147
Summary 156
References 157
5 The New Gearbox: A Peek Into the Future 161
Passive micromechanical structures 162
Hinge mechanisms 162
Sensors and analysis systems 163
Miniature biochemical reaction chambers 163
Electrophoresis on a chip 168
Microelectrode arrays 171
Actuators and actuated systems 176
Micromechanical resonators 176
High-frequency filters 180
“Grating light valve” display 183
Optical switches 187
Micropumps 190
Thermomechanical data storage 192
RF switch over gallium arsenide 197
Summary 198
References 198
6 The Box: Packaging for MEMS 201
Key design and packaging considerations 202
Wafer or wafer-stack thickness 204
Wafer dicing concerns 204
ix An Introduction to Microelectromechanical Systems Engineering
Thermal management 205
Stress isolation 207
Protective coatings and media isolation 208
Hermetic packaging 210
Calibration and compensation 211
Die-attach processes 212
Wiring and interconnects 216
Electrical interconnects 216
Microfluidic interconnects 220
Types of packaging solutions 222
Ceramic packaging 223
Metal packaging 228
Molded plastic packaging 230
Summary 235
References 235
Glossary 239
About the Author 251
Index 253 |
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发表于 2008-9-15 21:52:55
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