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发表于 2008-7-18 00:28:13
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A 45-nm Bulk CMOS Embedded SRAM With Improved Immunity Against Process and Temperature Variations
Abstract:
The variation tolerant assist circuits of an SRAM
against process and temperature are proposed. Passive resistances
are introduced to the read assist circuit with replica memory
transistors to lower the wordline voltage accurately reflecting the
process and temperature variations. For the sake of not only enlarging
the write margin but also reducing power consumption and
speed overhead, the divided dynamic power-line scheme based on
a charge sharing is adopted. Test chips of 512-Kb SRAM macros
and isolated memory cell TEGs are fabricated using 45-nm bulk
CMOS technology. Two types of 6-T SRAM cells, whose sizes were
0.245 um2 and 0.327 um2 were designed and evaluated. From
the measurement results, we achieved over 100-mV improvement
for static noise margin, and 35 mV for write margin for both
SRAM cells at 1.0-V worst condition by using assist circuitry. It
enables the wordline level to keep higher voltage at the slowest
condition than the typical process condition, which results in 83%
improvement of the cell current compared with the conventional
assist circuit. Furthermore, the minimum operating voltage in the
worst case condition was improved by 170 mV, confirming a high
immunity against process and temperature variations with less
than 10% area overhead.
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