Cadence RAK : 3D RISC-V System Planning with 3Dblox

DT27

3D RISC-V System Planning with 3Dblox™ Language Using Integrity 3DIC Platform

The developed 3Dblox™ language standard provides a systematic solution for integration of RTL-to-GDSII design flows of 3D integrated circuits. 3DFabric architectures will be supported by 3Dblox™ design templates as 3D-IC design solutions provided to customers. These templates contain the necessary 3dbv and 3dbx files to construct a blackbox model at the early design stage and represent the 3D stacking for several analyses at the later design stages with interoperability. With the mandatory design information template, designs can be divided and modified for specific chiplet design requirements. This gives customers a streamline model to create their 3D-IC design. It also drastically simplifies architectural decisions because it allows easy swapping between 3DFabrics.


RAK附件档案

通过网盘分享的文件：riscv_3dic_v3q.tgz
链接: https://pan.baidu.com/s/1TlQlqA7nO0CotjI45FtblQ
提取码: rtrf

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