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少有的接地、屏蔽方面的专著。
目录:
Preface to the Fifth Edition xi
1. Voltage and Capacitance 1
1.1. Introduction 1
1.2. Charges and Electrons 2
1.3. The Electric Force Field 4
1.4. Field Representations 4
1.5. The Defi nition of Voltage 6
1.6. Equipotential Surfaces 8
1.7. The Electric Force Field between Two Conducting Plates 9
1.8. Electric Field Patterns 10
1.9. The Energy Stored in an Electric Field 13
1.10. Dielectrics 15
1.11. The D Field 15
1.12. Capacitance 17
1.13. Mutual Capacitance 18
1.14. Displacement Current 19
1.15. Energy Stored in a Capacitor 21
1.16. Forces in the Electric Field 21
1.17. Capacitors 22
2. Magnetics 23
2.1. Magnetic Fields 23
2.2. Biot and Savart’s Law 24
2.3. The Solenoid 25
2.4. Faraday’s Law and the Induction Field 25
2.5. Inductance 27
2.6. The Energy Stored in an Inductance 27
2.7. Magnetic Field Energy in Space 29
2.8. The Magnetic Circuit 30
2.9. A Magnetic Circuit with a Gap 32
2.10. Small Inductors 33
2.11. Self- and Mutual Inductance 34
2.12. Transformer Action 34
2.13. Hysteresis and Permeability 38
2.14. Eddy Currents 39
2.15. The Transport of Electrical Energy 40
2.16. Poynting’s Vector 41
2.17. Transmission Lines Introduction 42
2.18. Transmission Line Operations 43
2.19. Transmission Line Field Patterns 44
2.20. Interfering Fields 47
3. Utility Power and Facility Grounding 49
3.1. Introduction 49
3.2. History 49
3.3. Semantics 50
3.4. The Earth as a Conductor 51
3.5. The Neutral Connection to Earth 52
3.6. Ground Potential Differences 53
3.7. Field Coupling to Power Conductors 54
3.8. Neutral Conductors 55
3.9. K-Factor in Transformers 56
3.10. Ungrounded Power 57
3.11. A Request for Power 57
3.12. Earth Power Currents 58
3.13. Line Filters 58
3.14. Isolated Grounds 59
3.15. Facility Grounds—Some More History 61
3.16. Lightning 62
3.17. Lightning and Facilities 63
4. Analog Circuits 65
4.1. Introduction 65
4.2. Instrumentation 65
4.3. History 67
4.4. The Basic Shield Enclosure 68
4.5. The Enclosure and Utility Power 69
4.6. The Two-Ground Problem 72
4.7. Instrumentation and the Two-Ground Problem 73
4.8. Strain-Gauge Instrumentation 75
4.9. The Floating Strain Gauge 76
4.10. The Thermocouple 78
4.11. The Basic Low-Gain Differential Amplifi er 78
4.12. Shielding in Power Transformers 80
4.13. Calibration and Interference 82
4.14. The Guard Shield above 100 kHz 82
4.15. Signal Flow Paths in Analog Circuits 83
4.16. Parallel Active Components 84
4.17. Feedback Stability—Introduction 84
4.18. Feedback Theory 85
4.19. Output Loads and Circuit Stability 86
4.20. Feedback Around a Power Stage 87
4.21. Constant-Current Loops 88
4.22. Filters and Aliasing Errors 88
4.23. Isolation and DC-to-DC Converters 89
4.24. Charge Converter Basics 91
4.25. Guard Rings 94
4.26. Thermocouple Effects 94
4.27. Guard Switching 94
4.28. Digital Control 95
5. Radiation 97
5.1. Handling Radiation and Susceptibility 97
5.2. Radiation: What Is It? 98
5.3. The Dipole Antenna 101
5.4. Wave Impedance 102
5.5. Field Strength and Antenna Gain 103
5.6. Radiation from Loops 104
5.7. E-Field Coupling to a Loop 106
5.8. A Note on Sine Wave Analysis 106
5.9. Approximations for Pulses and Square Waves 107
5.10. Radiation from a Printed Circuit Board 111
5.11. The Sniffer and the Antenna 112
5.12. Solar Magnetic Storms 113
5.13. Radiation from the Earth 113
6. Hardware 115
6.1. Cables with Foil Shields 115
6.2. Coaxial Cables 116
6.3. Low-Noise Cables 118
6.4. Transfer Impedance 118
6.5. Wave Guides 120
6.6. Electromagnetic Fields Over a Ground Plane 121
6.7. Skin Effect 122
6.8. Ohms per Square 123
6.9. Fields and Conductors 125
6.10. Conductive Enclosures—Introduction 126
6.11. Coupling through Enclosure Walls by an Induction Field 127
6.12. Refl ection and Absorption of Field Energy at a
Conducting Surface 127
6.13. Independent Apertures 129
6.14. Dependent Apertures 130
6.15. Honeycombs 131
6.16. Summing Field Penetrations 131
6.17. Power Line Filters 132
6.18. Back Shell Connectors 134
6.19. H-Field Coupling 135
6.20. Gaskets 136
6.21. Finger Stock 137
6.22. Glass Apertures 137
6.23. Guarding Large Transistors 138
6.24. Mounting Components on Surfaces 139
6.25. Zappers 139
7. Digital Electronics 141
7.1. Introduction 141
7.2. Circuit Board Material 143
7.3. The Two-Sided Circuit Board 143
7.4. Multilayer Circuit Boards 144
7.5. Ground Planes and Digital Circuit Boards 146
7.6. Clocked Logic 149
7.7. The Transmission of a Single Logic Signal 151
7.8. Decoupling Capacitors 154
7.9. The Power Plane 156
7.10. The Ground and Power Plane Capacitance 157
7.11. Using Vias 158
7.12. Decoupling Capacitors as Transmission Lines 159
7.13. Characteristic Impedance Control 161
7.14. Radiation from Digital Boards 163
7.15. Measurement Problems—Ground Bounce 163
7.16. High Clock Rates 164
7.17. Balanced Transmission 166
7.18. Ribbon Cable and Connectors 167
7.19. Daughter Boards 168
7.20. Mixing Analog and Digital Circuits 168
7.21. Optical Isolation 169
7.22. Gold Plating 169
7.23. GHz Notes 170
8. Facility Hardware 171
8.1. Ground Planes 171
8.2. A Facility Ground Plane Using Stringers 172
8.3. Other Ground Planes 174
8.4. Ground Planes and Remote Sites 175
8.5. Extending Ground Planes 175
8.6. Separately Derived Power 176
8.7. Surge Protection 178
8.8. The Isolation Transformer 178
8.9. Screen Rooms 179
8.10. Motor Controllers 181
8.11. A True Story 183
References 185
Index 187
[ 本帖最后由 alamoo 于 2008-1-18 22:43 编辑 ] |
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