3D Microelectronic Packaging From Architectures to Applications 2nd edition @2021

blackdone · 发表于 2022-10-31 13:32:37

thnks for good packaging docs

现实的路139 · 发表于 2022-11-18 20:32:19

好多先进封装的新书

myjobtel · 发表于 2022-12-2 23:19:03

Thanks a lot

lyfztz · 发表于 2022-12-10 14:29:30

感谢楼主的分享啊！

jimcmwang · 发表于 2022-12-22 00:31:46

3D Microelectronic Packaging From Architectures to Applications (Yan Li, Deepak .zip 25.91 MB, 下载次数: 101 , 下载积分: 资产 -8 信元, 下载支出 8 信元

waveguides · 发表于 2022-12-22 03:52:05

楼主辛苦了

zhyu101 · 发表于 2023-1-9 11:42:22

感谢楼主分享

lans0625 · 发表于 2023-1-9 12:53:19

thanks

Billmtk · 发表于 2023-1-11 14:30:25

good data for us

dannyyip · 发表于 2023-1-12 15:49:51

谢谢分享，我有第一版

[资料] 3D Microelectronic Packaging From Architectures to Applications 2nd edition @2021