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[求助] icc在创建物理库的时候,金属通孔那报warning

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发表于 2020-7-29 14:16:31 | 显示全部楼层 |阅读模式

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创建物理库的时候,如果出现下面的问题:
icc_shell> create_mw_lib $lib_name -open -technology $tech_file -mw_reference_library "$ref_lib" -bus_naming_style {[%d]}
Start to load technology file /home/IC/work/tsmc18_std_cell/tcb018gbwp7t_290a/TSMCHOME/digital/Back_End/milkyway/tcb018gbwp7t_270a/techfiles/tsmc018_6lm.tf.
Warning: Layer 'METAL1' has a pitch 0.56 that does not match the recommended wire-to-via pitch 0.535. (TFCHK-049)
Warning: Layer 'METAL2' has a pitch 0.56 that does not match the recommended wire-to-via pitch 0.61. (TFCHK-049)
Warning: Layer 'METAL5' has a pitch 0.56 that does not match the recommended wire-to-via pitch 0.66 or 0.61. (TFCHK-049)
Warning: Layer 'METAL6' has a pitch 0.9 that does not match the recommended wire-to-via pitch 0.95. (TFCHK-049)
Warning: Layer 'METAL3' has a pitch 0.56 that does not match the doubled pitch 1.12 or tripled pitch 1.68. (TFCHK-050)
Warning: Layer 'METAL4' has a pitch 0.56 that does not match the doubled pitch 1.12 or tripled pitch 1.68. (TFCHK-050)
Warning: Layer 'METAL5' has a pitch 0.56 that does not match the doubled pitch 1.12 or tripled pitch 1.68. (TFCHK-050)
Warning: Layer 'METAL6' has a pitch 0.9 that does not match the doubled pitch 1.12 or tripled pitch 1.68. (TFCHK-050)
Warning: CapModel sections are missing. Capacitance models should be loaded with a TLU+ file later. (TFCHK-084)
需要解决吗?

发表于 2021-9-25 21:59:59 | 显示全部楼层
请问这个你解决了么
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