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Latchup-Like Failure of Power-Rail ESD Clamp
Circuits in CMOS Integrated Circuits Under
System-Level ESD Test
Ming-Dou Ker and Cheng-Cheng Yen
Nanoelectronics & Gigascale Systems Laboratory
Institute of Electronics, National Chiao-Tung University, Hsinchu, Taiwan
Abstract—
Two different on-chip power-rail electrostatic
discharge (ESD) protection circuits, (1) with NMOS and PMOS
feedback; and (2) with cascaded PMOS feedback, have been
designed and fabricated in a 0.18-μm CMOS technology to
investigate their susceptibility to system-level ESD test. The
main purpose for adopting the feedback loop into the power-rail
ESD clamp circuits is to avoid the false triggering during a fast
power-up operation. However, during the system-level ESD test,
where the ICs in a microelectronics system have been powered
up, the feedback loop used in the power-rail ESD clamp circuit
provides the lock function to keep the main ESD device in a
“latch-on” state. The latch-on ESD device, which is often
designed with a larger device dimension to sustain high ESD
level, conducts a huge current between the power lines to
perform a latchup-like failure after the system-level ESD test.
The susceptibility of power-rail ESD clamp circuits with the
additional board-level noise filter to the system-level ESD test is
also investigated. To meet high system-level ESD specifications,
the chip-level ESD protection design should be considered with
the transient noise during system-level ESD stress.
Keywords- Electrostatic Discharge (ESD), system-level ESD
test, power clamp circuits, board-level noise filter. |
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