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楼主: qaf98

[资料] Advanced Flip Chip Packaging

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发表于 2021-12-20 18:52:11 | 显示全部楼层
:victory:
发表于 2021-12-23 21:40:33 | 显示全部楼层
确实好书
发表于 2022-1-3 22:41:00 | 显示全部楼层
谢谢分享
发表于 2023-2-16 13:43:33 | 显示全部楼层
I am really thankfull to you
I am really thankfull to you !
发表于 2023-3-6 22:20:58 | 显示全部楼层
To our knowledge, flip chip-centric reference books have for the most part been edited and published over a decade ago. A case in point includes those edited by John Lau. At that time, flip chip was still considered a luxury, reserved only for high-end, high-performance applications such as mainframes and workstations. Over the past decade, however, profound technological advancements have enabled the proliferation of low-cost highly reliable flip chip packages for applications covering all four Cs, namely, computing, communications, and consumer and car electronics. Going forward, the demand for flip chip will continue to grow to meet the insatiable appetite of consumers for performance, size, cost, and environmental compatibility as we enter into the consumer era.
发表于 2024-3-31 12:27:17 | 显示全部楼层
thanks for sharing
发表于 2024-4-17 21:02:17 | 显示全部楼层

谢谢分享~~
2013年

Ho-Ming Tong • Yi-Shao Lai • C.P. Wong

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发表于 2024-4-17 21:12:47 | 显示全部楼层
谢谢分享~~
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