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发表于 2018-1-6 15:04:17
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Foreword xiiiPreface xvPreface to First Edition xixCHAPTER 1MEMS: A Technology from Lilliput 1The Promise of Technology 1What Are MEMS—or MST? 2What Is Micromachining? 3Applications and Markets 4To MEMS or Not To MEMS? 7Standards 8The Psychological Barrier 8Journals, Conferences, and Web Sites 9List of Journals and Magazines 9List of Conferences and Meetings 10Summary 11References 11Selected Bibliography 12CHAPTER 2Materials for MEMS 13Silicon-Compatible Material System 13Silicon 13Silicon Oxide and Nitride 19Thin Metal Films 20Polymers 21Other Materials and Substrates 21Glass and Fused Quartz Substrates 21Silicon Carbide and Diamond 22Gallium Arsenide and Other Group III-V Compound Semiconductors 22Polymers 23Shape-Memory Alloys 23Important Material Properties and Physical Effects 24viiPiezoresistivity 24Piezoelectricity 26Thermoelectricity 29Summary 31References 31Selected Bibliography 32CHAPTER 3Processes for Micromachining 33Basic Process Tools 34Epitaxy 34Oxidation 35Sputter Deposition 35Evaporation 36Chemical-Vapor Deposition 37Spin-On Methods 40Lithography 40Etching 44Advanced Process Tools 55Anodic Bonding 55Silicon Direct Bonding 56Grinding, Polishing, and Chemical-Mechanical Polishing 57Sol-Gel Deposition Methods 58Electroplating and Molding 58Supercritical Drying 60Self-Assembled Monolayers 61SU-8 Photosensitive Epoxy 61Photosensitive Glass 62EFAB 62Nonlithographic Microfabrication Technologies 63Ultraprecision Mechanical Machining 64Laser Machining 64Electrodischarge Machining 65Screen Printing 65Microcontact Printing/Soft Lithography 66Nanoimprint Lithography 67Hot Embossing 67Ultrasonic Machining 68Combining the Tools—Examples of Commercial Processes 68Polysilicon Surface Micromachining 69Combining Silicon Fusion Bonding with Reactive Ion Etching 71DRIE of SOI Wafers 71Single Crystal Reactive Etching and Metallization 72Summary 74References 75Selected Bibliograp |
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