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楼主: mabas.masood

[其它] tsmc 130nm pdk (cdb)

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发表于 2014-11-28 18:17:18 | 显示全部楼层
可供学习的好东西
发表于 2014-11-29 21:34:03 | 显示全部楼层
好东东,谢谢
发表于 2014-11-29 22:56:17 | 显示全部楼层
谢谢分享!
发表于 2014-11-30 11:47:07 | 显示全部楼层
感谢分享,学习
发表于 2014-12-3 04:06:01 | 显示全部楼层
有没有45nm的?想学习一下高速电路。
发表于 2014-12-10 15:30:42 | 显示全部楼层
就两个包?
发表于 2015-1-3 11:35:43 | 显示全部楼层
谢谢楼主分享
发表于 2015-1-3 11:59:23 | 显示全部楼层
though it spend me a lot of money, thanks for sharing
发表于 2015-1-3 12:03:33 | 显示全部楼层
Though it spend me a lot of money, thanks for sharing
发表于 2015-1-9 01:00:51 | 显示全部楼层
Hi,
  I'm new in Cadence and I'm designing circuits with TSMC0.13um PDK. My circuit contains 8 layers, but I don't know; how to place a via between two layers? for example metal via between met1 and met2.
  I'm trying to do this in schematic, may be this is not possible in the schematic? because in the vias folder of my KitDesign TSMC90nm there are only symbolic and layout folders? if this is correct in which step, we can add vias between layers and via_gnd to take their influence in the performance of the designed circuits (during simulation with cadence).
   I will appreciate your help.
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