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Layout Consideration and Circuit Solution to Prevent
EOS Failure Induced by LatchupTest in a High-Voltage Integrated Circuits
Abstract—This paper presented a practical industry case of
electrical overstress (EOS) failure induced by the latchup test
in high-voltage integrated circuits (ICs). By using proper layout
modification and additional circuit, the unexpected EOS failure,
which is caused by negative-current-triggered latchup test, can
be successfully solved. The new design with proposed solutions
has been verified in the 0.6-μm 40-V Bipolar CMOS DMOS
(BCD) process to pass the test for at least 500-mA trigger current,
which shows high negative-current-latch-up immunity without
overstressdamage,comparedwiththeprotectionofonlytheguard
ring.Suchsolutionscanbeadoptedtoimplementhigh-voltage-ap-
plicableICproducttomeettheindustryrequirementforthemass
productionof ICmanufactures and applications.
IndexTerms—Electricaloverstress(EOS),high-voltageCMOS,
latchup,regulator. |
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