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CMOS和MEMS集成的一篇综述。但是文章题目过大,其实只提供了一种方案。 
看看还是很有意思的。 
CMOS-MEMS integration can improve the performance of the 
MEMS (micro-electromechanical systems), allows for smaller 
packages and leads to a lower packaging and instrumentation 
cost. As argued in this article, processing MEMS above CMOS is 
the most promising approach for CMOS-MEMS integration, but it 
limits the thermal budget for MEMS processing. Poly-SiGe 
provides the desired material properties for MEMS applications at 
significantly lower temperatures compared to Poly-Si. A case 
study of a CMOS-integrated SiGe gyroscope will be presented. |   
 
 
 
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