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CMOS和MEMS集成的一篇综述。但是文章题目过大,其实只提供了一种方案。
看看还是很有意思的。
CMOS-MEMS integration can improve the performance of the
MEMS (micro-electromechanical systems), allows for smaller
packages and leads to a lower packaging and instrumentation
cost. As argued in this article, processing MEMS above CMOS is
the most promising approach for CMOS-MEMS integration, but it
limits the thermal budget for MEMS processing. Poly-SiGe
provides the desired material properties for MEMS applications at
significantly lower temperatures compared to Poly-Si. A case
study of a CMOS-integrated SiGe gyroscope will be presented. |
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