2010-Low Cap Low Loss Bond Pad for RF

semico_ljj

Low-Capacitance and Low-Loss Bond Pad Design Using LC-Resonator Structure
in CMOS Technology for RF and High-Speed Applications

Chun-Yu Lin1 and Ming-Dou Ker1,2
1Nanoelectronics and Gigascale Systems Laboratory, Institute of Electronics
National Chiao-Tung University, Hsinchu, Taiwan
2Department of Electronic Engineering, I-Shou University, Kaohsiung, Taiwan

semico_ljj

best...

mtwumtwu

good reference for RF design

tingyc

谢谢！谢谢！

mingyulane

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iyahsue

GOOOOOOOOOOOOOOOOOOD

amirjon

thanks

Minibaby

感兴趣，实用

waley

package dominate high speed IP
this is important
3q~

xuleiwx

有参考意义的文章。