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Improving Safe Operating Area of LDMOS Array
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 Rectifier for ESD Protection
 in a 24-V BCD Process
 
 Wen-Yi Chen, Student Member, IEEE, and Ming-Dou Ker, Fellow, IEEE
 
 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 58, NO. 9, SEPTEMBER 2011
 
 Abstract—In high-voltage technologies, silicon-controlled rectifier
 (SCR) is usually embedded in output arrays to provide a
 robust and self-protected capability against electrostatic discharge
 (ESD). Although the embedded SCR has been proven as an excellent
 approach to increasing ESD robustness, mistriggering of
 the embedded SCR during normal circuit operating conditions
 can bring other application reliability concerns. In particular,
 the safe operating area (SOA) of output arrays due to SCR insertion
 has been seldom evaluated. In this paper, the impact of
 embedding SCR to the electrical SOA (eSOA) of an n-channel
 LDMOS (nLDMOS) array has been investigated in a 24-V bipolar
 CMOS–DMOS process. Experimental results showed that the
 nLDMOS array suffers substantial degradation on eSOA due to
 embedded SCR. Design approaches, including a new proposed
 poly-bending (PB) layout, were proposed and verified in this paper
 to widen the eSOA of the nLDMOS array with embedded SCR.
 Both the high ESD robustness and the improved SOA of circuit
 operation can be achieved by the new proposed PB layout in the
 nLDMOS array.
 
 Index Terms—Electrostatic discharge (ESD), poly-bending (PB)
 layout, reliability, safe operating area (SOA), silicon-controlled
 rectifier (SCR).
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