在线咨询
eetop公众号 创芯大讲堂 创芯人才网
切换到宽版

EETOP 创芯网论坛 (原名:电子顶级开发网)

手机号码,快捷登录

手机号码,快捷登录

找回密码

  登录   注册  

快捷导航
搜帖子
EETOP诚邀模拟IC相关培训讲师 创芯人才网--重磅上线啦!
查看: 2315|回复: 9

[资料] Spring-2009-Solder Joint Reliability Prediction for Multiple Environments

[复制链接]
发表于 2016-8-26 13:45:41 | 显示全部楼层 |阅读模式

马上注册,结交更多好友,享用更多功能,让你轻松玩转社区。

您需要 登录 才可以下载或查看,没有账号?注册

x

                               
登录/注册后可看大图

Solder Joint Reliability Prediction for Multiple Environments --- 综合环境中的焊点可靠性预测
2009 Solder Joint Reliability Prediction for Multiple Environments.pdf (4.06 MB, 下载次数: 50 )

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.




TABLE OF CONTENTS
Chapter 1. Introduction ................................................................................... 1
1.1. Book layout ........................................................................................ 4
Chapter 2. Background.................................................................................... 7
2.1. CCGA and CBGA Electronic Packages .............................................. 7
2.2. CCGA Test Vehicle Description ......................................................... 9
2.3. Solder Material Behavior and Fatigue............................................... 11
2.4. Damage Parameters for Fatigue Prediction ....................................... 18
2.5. Solder Joint Fatigue Failure Prediction ............................................. 19
2.6. Cumulative Damage Prediction: Miner’s Rule.................................. 21
2.7. Laser Moiré Interferometry ............................................................... 22
2.8. Vibration Theory ............................................................................... 26
2.9. Chapter Summary.............................................................................. 36
Chapter 3. Literature Review........................................................................ 39
3.1. Thermal Cycling................................................................................ 39
3.2. Power Cycling ................................................................................... 42
3.3. Vibration Environment ...................................................................... 45
3.4. Multiple Combined or Sequential Environments .............................. 47
3.5. Pb-free Solder Joint Reliability ......................................................... 48
3.6. Chapter Summary.............................................................................. 58
Chapter 4. Unified Finite Element Modeling for Prediction of Solder Joint
Fatigue .......................................................................................... 65
4.1. Unified Finite Element Modeling Methodology ............................... 65
4.2. Choice of Material Models and Elements ......................................... 76
4.3. Compatibility of Element Types and Material Models ..................... 77
4.4. Calculation of Damage Parameter ..................................................... 78
4.5. Choice of Stress-free Temperature .................................................... 78
4.6. Chapter Summary.............................................................................. 80
Chapter 5. Validation of Unified FEM for Thermal Cycling and Power
Cycling Environments................................................................. 83
5.1. Laser Moiré Interferometry ............................................................... 83
5.2. Laser Moiré Studies on CCGA Package Assembly........................... 85
5.3. Laser Moiré Studies on CBGA Package Assembly........................... 91
5.4. FEM Accelerated Thermal Cycling Verification with Laser Moiré
Interferometry.................................................................................... 96
5.5. Importance of Including Creep in Every Solder Joint of FEM.......... 99
5.6. Power Cycling Verification............................................................... 99
5.7. Chapter Summary............................................................................ 101
发表于 2016-8-28 14:45:58 | 显示全部楼层
shoucang
发表于 2016-10-4 21:51:09 | 显示全部楼层
GOOOOOOOOOOOOD
发表于 2016-10-9 14:19:30 | 显示全部楼层
这种专业类的书籍太难得了。多谢楼主!!
发表于 2020-11-15 10:03:15 | 显示全部楼层
资料不错
发表于 2020-11-16 10:16:56 | 显示全部楼层
Thansk
发表于 2021-1-9 22:58:51 | 显示全部楼层
谢谢分享!
发表于 2021-1-9 22:59:49 | 显示全部楼层
Thanks, Thanks, Thanks.
发表于 2023-8-19 19:15:30 | 显示全部楼层
谢谢分享 好书
发表于 2023-8-20 07:48:20 | 显示全部楼层
Thanks
您需要登录后才可以回帖 登录 | 注册

本版积分规则

关闭

站长推荐 上一条 /1 下一条

小黑屋| 关于我们| 联系我们| 在线咨询| 隐私声明| EETOP 创芯网
( 京ICP备:10050787号 京公网安备:11010502037710 )

GMT+8, 2024-3-29 18:15 , Processed in 0.034073 second(s), 9 queries , Gzip On, Redis On.

eetop公众号 创芯大讲堂 创芯人才网
快速回复 返回顶部 返回列表