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Job Description   有兴趣的联系我sunny@genhr.com   MSN :stsh1020@hotmail.com   13641777463/021-60481748You will work closely with a world-class team of IC designers to perform physical design of highly-integrated, high-performance ICs with RF, analog, mixed-signal, and digital signal processing systems integrated on a single chip.  Responsibilities include physical design of demanding mixed-signal and RF layout blocks, chip-level floorplanning, place and route of digital blocks, top-level chip assembly, full-chip verification, chip tapeout, and mask data verification.  This position will require strong communication and problem-solving skills.  Versatility, initiative and the ability to adapt to a dynamic startup environment are essential.
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 Requirement:
 •        BS Degree in EE (with relevant specialization) or higher, with 5+ years of industrial working experience.
 •        Experience in analog and digital IC physical design with exposure to top-level assembly and chip tapeout procedures
 •        Solid understanding of physical, electrical rules and DFM rules for fine-geometry CMOS processes
 •        Direct experience in RF layout and knowledge of semiconductor devices and fabrication principles
 •        Proficiency in block level floorplanning, understanding of device matching issues such as WPE and STI
 •        Ability to estimate and minimize parasitics prior to detailed layout extraction
 •        Comprehension of isolation issues and ability to create effective shielding / isolation structures
 •        Experience with industry-standard layout and verification tools (Cadence: Viruoso, Assura, Encounter; Mentor: Calibre) and proficiency in a Unix workstation environment
 •        Experience with PCB layout tools, lab test and measurement equipment, VBA programming or LabView programming beneficial.
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