新书：3D Integration for NoC-based SoC Architectures

kong2008

简述：
3D integration technologies, 3D-Design techniques, and 3D-Architectures are
emerging as truly hot and broad research topics. As the end of scaling the CMOS
transistor comes in sight, the third dimension may come to the rescue of the industry
to allow for a continuing exponential growth of integration during the 2015–2025
period. As such 3D stacking may be the key technology to sustain growth until more
exotic technologies such as nanowires, quantum dot devices and molecular computers
become sufficiently mature for deployment in main stream application areas.
The present book gathers the recent advances in the domain written by renowned
experts to build a comprehensive and consistent book around the topics of threedimensional
architectures and design techniques.
In order to take full advantage of the 3D integration, the decision on the use
of in-circuit vertical connection (predominantly Through-Silicon-Vias (TSVs) and
Inductive Wireless Interconnects) must come upfront in the architecture planning
process rather than as a packaging decision after circuit design is completed. This
requires taking the 3D design space into account right from the start of the system
design. Previously published books about this active research domain focus on fabrication
technologies and physical aspects, rather than network and system-level
architectural concerns. In contrast, the present book covers almost all architectural
design aspects of 3D-SoCs, and as such can be useful both for introducing the current
research topics to researchers and engineers, giving a basis for education and
training in M.Sc. and Ph.D. programs.
The book is divided into three parts. The first part, which contains two chapters,
deals with the promises and challenges of 3D integration. ChapterÂ

fpga_sh

thank you very much

fpga_sh

thank you very much

billwaston

谢谢分享

billwaston

谢谢分享

michal_pp

需要，谢谢

michal_pp

谢谢分享

whjs08101056

好东西，谢谢分享

mtwumtwu

good topic for study