09新书 Circuits at the Nanoscale: Communications, Imaging, and Sensing

nccise

                               
登录/注册后可看大图

Circuits for Emerging Technologies Beyond CMOS
New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.

About the Author
CMOS Emerging Technologies Inc., Vancouver, British Columbia

Contents
Editor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix
Contributors.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
PART I CMOS Technology at the Nanoscale
Chapter 1 CMOS: An Emerging Technology System Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Paul Rousseau
Chapter 2 CMOS Manufacturability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Artur Balasinski
Chapter 3 Variability in Deeply Scaled CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Liang-Teck Pang and Borivoje Nikoli´c
Chapter 4 Wafer-Level Three-Dimensional Integration for Advanced CMOS Systems . . . . . . . . 39
Ronald J. Gutmann and Jian-Qiang Lu
Chapter 5 CMOS SOI Memory Design Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Kazutami Arimoto and Fukashi Morishita
Chapter 6 SiGe Technology.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Marco Racanelli
PART II Emerging Design Techniques
Chapter 7 Offset, Flicker Noise, andWays to Deal with Them. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Hanspeter Schmid
Chapter 8 Design ofWideband Amplifiers in CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
David J. Allstot, Sudip Shekhar, and Jeffrey S. Walling
Chapter 9 CMOS Active Transformers and Their Applications .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Fei Yuan
Chapter 10 High-Performance Leakage/Variation-Tolerant Circuit Technologies
for 45 nm and Below . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
Amit Agarwal and Ram Krishnamurthy
Chapter 11 Soliton and NonlinearWave Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
David S. Ricketts, Xiaofeng Li, and Donhee Ham
PART III Mixed-Signal CMOS Circuits
Chapter 12 Current Steering Digital-to-Analog Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Douglas A. Mercer
Chapter 13 High-Speed, Low-Power CMOS A/D Converter for Software Radio . . . . . . . . . . . . . 213
James W. Haslett and Abdel-Fattah S. Yousif
Chapter 14 Energy-Efficient ADC Topology Enabled with Asynchronous Techniques . . . . . . . 225
Shuo-Wei Mike Chen
Chapter 15 High-Frequency Filters for Data Communication Applications . . . . . . . . . . . . . . . . . . . 245
Manisha Gambhir, Vijay Dhanasekaran, Jose Silva-Martinez,
and Edgar Sánchez-Sinencio
Chapter 16 Continuous Time
 Modulators.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267
Robert Sobot
PART IV Circuits for Communications
Chapter 17 Low-Voltage Nanometer-Scale CMOS RF Front-End Block Design
EmployingMagnetic Feedback Techniques . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289
Yannis Papananos, Georgios Vitzilaios, and Gerasimos Theodoratos
Chapter 18 InGaP-HBT Power Amplifiers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319
Kazuya Yamamoto
Chapter 19 
Digital-RF Modulation for AdaptiveWideband Systems. . . . . . . . . . . . . . . . . . . . . . 343
Albert Jerng and Charles G. Sodini
Chapter 20 Deep-Submicron CMOS Design ChallengesWhen Integrating the RF
Front-End and Digital Baseband in a Single-Chip Receiver SoC . . . . . . . . . . . . . . . . . . 363
Adrian Maxim
Chapter 21 Mitigation of CMOS Device Variability in Digital RF Processor. . . . . . . . . . . . . . . . . . 399
Khurram Waheed and Robert Bogdan Staszewski
Chapter 22 Front-End Circuits for Multi-Gb/s Chip-to-Chip Links . . . . . . . . . . . . . . . . . . . . . . . . . . . . 419
Anthony Chan Carusone
Chapter 23 Clock and Data Recovery Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 437
Jafar Savoj
PART V Circuits for Imaging and Sensing
Chapter 24 Low Power CMOS Imager Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 457
Alexander Fish and Orly Yadid-Pecht
Chapter 25 CMOS Imager Array Design, Operation, and Trends . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 485
Mark Jaffe, John Ellis-Monaghan, and Jim Adkisson
Chapter 26 Wide Dynamic Range CMOS Cameras . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503
Steve Collins, Bhaskar Choubey, Hsiu-Yu Cheng, and Stephen Otim
Chapter 27 CMOS Focal Plane Spatially Oversampling Computational Image Sensor . . . . . . . 521
Ashkan Olyaei and Roman Genov
Chapter 28 Unified Computer Arithmetic for Handheld GPUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 539
Byeong-Gyu Nam, Hyejung Kim, and Hoi-Jun Yoo
Chapter 29 Sense Circuits for Integrated Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 561
Sitaraman V. Iyer and Hasnain Lakdawala
Chapter 30 Detector Interface Circuits for X-Ray Imaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 575
Pawel Grybos
Chapter 31 CMOS Systems and Interfaces for Microgyroscopes.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601
Ajit Sharma, Mohammad F. Zaman, and Farrokh Ayazi
Chapter 32 Analog Front End for a Micromachined Probe Storage Device. . . . . . . . . . . . . . . . . . . . 623
Christoph Hagleitner, Tony Bonaccio, Hugo Rothuizen, Jan Lienemann,
Dorothea Wiesmann, Giovanni Cherubini, Jan G. Korvink,
and Evangelos Eleftheriou

sssh

谢谢分享

ulsi123

Thank you for sharing this book. This one summarizes many latest design techniques in 45/65/90nm technologies, though some papers don't go in depth.

feiwang

nice book

turtlewang

how about this book?

kkzm

谢谢分享

kkzm

CRC | 2008 | ISBN: 1420070622 | 602 pages | PDF | 32,2 MB

pjing57

apteye

9# pjing57
xiexie

mikoyan

qqqqqqqqqqqqqqqqqqqq