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发表于 2010-7-28 10:24:56
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Abstract
Suppressing the leakage current in memories is critical
in low-power design. By reducing the standby supply voltage
(VDD) to its limit, which is the Data Retention Voltage (DRV),
leakage power can be substantially reduced. This paper explores
how low DRV can be in a standard low leakage
SRAM module and analyzes how DRV is affected by parameters
such as process variations, chip temperature, and transistor
sizing. An analytical model for DRV as a function of
process and design parameters is presented, and forms the
base for further design space explorations. This model is
verified using simulations as well as measurements from a
4KB SRAM chip in a 0.13 µm technology. It is demonstrated
that an SRAM cell state can be preserved at sub-300mV
standby VDD, with more than 90% leakage power savings. |
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