Integrated Circuit Packaging, Assembly and Interconnections

rabbit15 · 发表于 2010-9-3 05:51:30

part4

rabbit15 · 发表于 2010-9-3 05:52:32

part5

truviet911 · 发表于 2011-2-17 12:02:11

thanks aoot

gerade · 发表于 2011-4-7 16:56:43

需要好多钱才能下载，好想看咯

mscyc0909 · 发表于 2011-7-10 05:09:47

loading 1~2/6

mscyc0909 · 发表于 2011-7-10 05:11:02

loading 3~4/6

mscyc0909 · 发表于 2011-7-10 05:11:50

loading 5~6/6

mscyc0909 · 发表于 2011-7-10 05:16:14

Table of Contents:
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1 Electronic Manufacturing and the Integrated Circuit
2 Integrated Circuit Manufacturing: A Technology Resource
3 Packaging the IC—Single Chip Packaging
4 The Chip Scale Package
5 Multichip Packaging
6 Known Good Die (KGD)
7 Packaging Options—Chip on Board
8 Chip & Wire Assembly
9 Tape Automated Bonding—TAB
10 Flip Chip—The Bumping Processes
11 Flip Chip Assembly
12 HDI Substrate Manufacturing Technologies: Thin Film Technology
13 HDI Substrate Manufacturing Technologies: Thick Film Technology
14 HDI Substrate Manufacturing Technologies: Cofired Ceramic
15 Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate

skrainbow · 发表于 2011-10-30 23:47:09

谢谢分享

tom0626 · 发表于 2011-11-6 09:10:49

是好書，但希望是新版本。

Integrated Circuit Packaging, Assembly and Interconnections

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