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Semiconductor Device Reliability Failure Models
A.ELECTROMIGRATION
B.CORROSION
C. TIME DEPENDANT DIELECTRICBREAKDOWN
D. HOT CARRIER INJECTION
E. SURFACE INVERSION (Mobile Ions)
F. STRESSMIGRATION
G. TEMPERATURE CYCLING & THERMAL SHOCK
H. SOFT ERRORS (Single Event Upsets)
I. Design of Experiments for Determination of ModelingParameters
J. Time-To-FailureDistributions |
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