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08 半导体工艺设计新书【Handbook of Silicon Wafer Cleaning Technology Handbook of Silicon Wafer Cleaning Technology: Second Edition】！英文原版，高清晰PDF
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废话不多讲,先给了书的封面图：
[url=]Book description: The second edition of the Handbook of Silicon Wafer Cleaning Technologyis a collection of invited papers on wet, plasma, and other surfaceconditioning techniques used to manufacture integrated circuits. Theintegration of the clean processes into the device manufacturing flowis presented with respect to other manufacturing steps such as thermal,implant, etching, and photolithography processes. The Handbookdiscusses both wet and plasma-based cleaning technologies that are usedfor removing contamination, particles, residue, and photoresist fromwafer surfaces. Both the process and the equipment are covered. TheHandbook reviews the current cleaning technologies, as well as advancedcleaning technologies under investigation for next generationprocessing, including supercritical fluid, laser, and cryoaerosolcleaning techniques. In addition, the theoretical aspects of thecleaning technologies and how these processes affect the wafer arediscussed, including device damage and surface roughening. The analysisof the wafers surface is outlined. A discussion of the new materialsand the changes required for the surface conditioning process used formanufacturing is also included.[/url]
Table of Contents- Foreword
- Preface to the Second Edition
- Preface to the First Edition
- Part I - Introduction and overview
- 1 - Overview and Evolution of Silicon Wafer Cleaning Technology
- 2 - Overview of Wafer Contamination and Defectivity
- Part II - Wet chemical process
- 3 - Particle Deposition and Adhesion
- 4 - Aqueous Cleaning Surface Conditioning Processes
- Part III - Dry cleaning processes
- 5 - Gas-phase Wafer Cleaning Technology
- 6 - Plasma Stripping, Cleaning, and Surface Conditioning
- 7 - Cryogenic Aerosols and Supercritical Fluid Cleaning
- Part IV - Analytical and control aspects
- 8 - Detection and Measurement of Particulate Contaminants
- 9 - Surface Chemical Composition and Morphology
- 10 - Ultratrace Impurity Analysis of Wafer Surfaces
- Part V - Directions for the near future
- 11 - New Cleaning and Surface Conditioning Techniques and Technologies
- Book Editors and Chapters Authors
- Index
[ 本帖最后由 nuoan 于 2009-2-2 06:32 编辑 ] |
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发表于 2009-1-30 13:29:49
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