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Lecture 1 Registration and Course Introduction. Evolution of
Electronic Systems from Chips to Cabinets
Lecture 2 Interconnect and Packaging Modeling: Inductance,
Resistance, and Capacitance
Lecture 3 Interconnect and Packaging Modeling: Wires,
Connectors, Vias, and Solder Bumps
Lecture 4 System Noise and Noise Budget Design
Lecture 5 Digital Signal Integrity in High-Speed Electronic
Systems
Lecture 6 Power Supply Noise and Power Delivery Systems
Lecture 7 Power Distribution Design and Decoupling for Mixed-
Signal Systems
Lecture 8 EMC/EMI Fundamentals in Electronic Systems
Lecture 9 Shielding and Electrostatic Discharge (ESD) Protection
Lecture 10 Optoelectrics and Telecommunication System Packaging
Lecture 11 RF and Microwave Packaging/Board Design
Lecture 12 Performance Modeling and Conceptual Design of
Electronic Systems
Lecture 13 Interconnectivity and Rent’s Rule
Lecture 14 Thermal Design in Electronic System Packaging
Lecture 15 Exercise, Homework Correction, Project/Exam
Assignment |
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发表于 2008-6-16 10:43:49
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