Silicon Processing for the VLSI Era, Vol. 1～4

lotusky · 发表于 2008-5-10 22:38:01

马上注册，结交更多好友，享用更多功能，让你轻松玩转社区。

您需要登录才可以下载或查看，没有账号？注册

x

Silicon Processing for the VLSI Era, Vol. 1: Process Technology
by Stanley Wolf, Richard N. Tauber

登录/注册后可看大图

[size=120%]Silicon Processing for the VLSI Era, Vol. 1: Process Technology
By Stanley Wolf, Richard N. Tauber

Publisher:

Number Of Pages:

Publication Date:

ISBN-10 / ASIN:

ISBN-13 / EAN:

Binding: Hardcover

Summary: Silicon Processing for the VLSI Era
Rating: 5
"Silicon Processing for the VLSI Era" is by far the most authoritative guide to semiconductor processing and nano-fabrication in existence. Practical processing techniques as well as their underlying fundamental principles are thoroughly covered in detail. This book has been indispensable to me during my graduate education and has the solution to just about every fabrication problem I have encountered in my 5+ years of experience. I highly recommend this book to anyone who is trying to build a semiconductor device or just curious about how such things are done.

Summary: Disappointing
Rating: 2
I was forced to use this book as an undergrad. It was torture. Runyan and Bean ( Semiconductor Integrated Circuit Processing Technology by W.R. Runyan, K.E. Bean) and Ghandi (don't have title handy) are both much better and easier to read.

Summary: Just overview
Rating: 3
I don't like this series. Vol 1, 2 were used when I was in University The series just gave you overview. It won't explain in details. You have to research on your own. Since silicon processing changes in very fast pace, these books may already be out of date (almost 4 years ago). But it is still good reference. Basically, this book is just collection of the technical papers. I can find some articles are almost 'word by word' copied from the reference Journals and technical papers. Neverless, it still saves a lot of time to go to the library and get the journals (This may be the only good things I can find. THe journals are not cheap. IEEE subscripts for site is over $20K. There are more than IEEE journals in these books). When I have to get journals in library, it took 'long time' to search and go to the shelf to get the journal I want. However, I won't be very impressed in the book. As I said, this book is just summary of the reference journals. Sometimes (if not all the time), I can find the articles in the book are almost 'word by word' copied from the technical journals without any further explanation. I really doubt anyone knows the "details of physics" behind. But in the industrial, most people just trial and error, very little physics behind. I would say nobody cares too much physics, it took too much time to research and it is too difficult to keep up with new technilogies.

Summary: THE best set of technical references in this area
Rating: 5
In my 25 years of semiconductor process development I have never come across such a complete and in-depth collection of device and process knowledge in a single place. Years ago we needed to spend many hours with the journals to extract the requisite information to supplement our laboratory efforts. These volumes synthesize the basics with the most modern techniques now employed in advanced technologies. In addition, many subtle processing difficulties are addressed as well which will be much appreciated by the researcher. Through the years I have purchased in excess of 100 text references and none comes as close to these in the total knowledge contained within. These volumes are intended for the researchers and engineers working in this field yet they are so very well written and easy to comprehend that any one with such an interest in this field can understand them. Study these volumes completely.

Summary: Silicon Processing for the VLSI Era
Rating: 5
This book provides an outstanding presentation of Silicon processing technology that is technically current, rich in detail, and most importantly, factually correct. The new edition of this book appears to have been completely rewritten, and covers every important area of Silicon processing in a comprehensive manner. I especially enjoyed that fact that in each chapter of the book the basic principles underlying a technology are explained first, and these explanations are then integrated into descriptions of the relevant technology (i.e. PVD, CVD, CMP etc.). The two Lithography sections are beautifully done, and contain lucid explanations of concepts that I have not seen anywhere else. For anyone who is seriously interested in semiconductor manufacturing, this book is a "must have". No other volume even comes close to being this comprehensive.

[ 本帖最后由 lotusky 于 2008-5-10 23:11 编辑 ]

lotusky · 发表于 2008-5-10 22:38:52

Silicon Processing for the VLSI Era, Vol. 2: Process Integration
by Stanley Wolf, Richard N. Tauber

登录/注册后可看大图

[size=120%]Silicon Processing for the VLSI Era, Vol. 2: Process Integration
By Stanley Wolf, Richard N. Tauber

Publisher: Lattice Press
Number Of Pages: 752
Publication Date: 1990-03
ISBN-10 / ASIN: 0961672145
ISBN-13 / EAN: 9780961672140
Binding: Hardcover

[ 本帖最后由 lotusky 于 2008-5-12 21:38 编辑 ]

lotusky · 发表于 2008-5-10 22:39:42

Silicon Processing for the VLSI Era, Vol. 3: The Submicron MOSFET
by Stanley Wolf

[size=120%]Silicon Processing for the VLSI Era, Vol. 3: The Submicron MOSFET
By Stanley Wolf

Publisher:

Number Of Pages:

Publication Date:

ISBN-10 / ASIN:

ISBN-13 / EAN:

Binding: Hardcover

Summary: Good book
Rating: 5
Though this was not my first book on devices, I think it is an excellent resource for beginners.

[ 本帖最后由 lotusky 于 2008-5-12 08:18 编辑 ]

lotusky · 发表于 2008-5-10 22:41:25

Silicon Processing for the VLSI Era, Vol. 4: Deep-Submicron Process Technology
by Stanley Wolf

登录/注册后可看大图

[size=120%]Silicon Processing for the VLSI Era, Vol. 4: Deep-Submicron Process Technology
By Stanley Wolf

Publisher: Lattice Press
Number Of Pages: 822
Publication Date: 2002-05
ISBN-10 / ASIN: 096167217X
ISBN-13 / EAN: 9780961672171
Binding: Hardcover

Summary: Excellent review on the recent semiconductor processing
Rating: 4
This book collects the hot issues on the very recent deep submicron (less than 0.18um) semiconductor process technology, such as EUV lithography, high and low k materials, CMP, and 300mm wafer. It seems to provide a good guideline to anyone who wonders what it is going on in the semiconductor process industry.

Summary: THE LATEST IN AN EXCELLENT SERIES
Rating: 5
This well written reference book is highly recommended to anyone interested in the technology used to manufacture deep-submicron MOSFETs, i.e., MOSFETs requiring lithography in the 1/4 to 1/8-micron range. The first chapter nicely identifies several practical problems that appeared during the evolution of the MOSFET to ULSI, and the remainder of the book discusses processing solutions to those problems. Major processing topics include thin gate oxides, self-aligned silicides, high- and low-k dielectrics, double and triple level metal interconnects, dual damascene copper interconnects, copper seed and electroplating technology, deep uv photoresists and tools, chemical-mechanical planarization, and processing issues unique to 300-mm wafers. State of the art CMOS topics including super-steep retrograde channel doping, punchthrough-control implants, source/drain engineering, shallow trench isolation, and more are used to illustrate the integration of deep-submicron processes into manufacturing. Increasing use of Si-Ge heterojunction bipolar transistors and silicon-on-insulator is anticipated and discussed. This up-to-date book is one of a kind. It is simply required reading for those in the business.

[ 本帖最后由 lotusky 于 2008-5-12 11:14 编辑 ]