ebook:Thermal and Power Management of Integrated Circuits

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Thermal and Power Management of Integrated Circuits

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Foreword
Chapter 1. Introduction
1. Evolution of CMOS Technology
2. Emergence of Thermal Issues
3. Motivation of  this Book
Chapter 2. Power, Junction Temperature, and Reliability
1. Power in Nanometer Regime
2. Leakage Reduction Techniques
3. Junction Temperature Projections
for Deep Sub-micron Technologies
4. Reliability Issues in Scaled Technologies
5. Summary
Chapter 3. Burn-in as a Reliability Screening Test
1. Burn-in
2. What is Burn-in?
3. Temperature and Voltage Acceleration Factors
4. Technology Scaling and Burn-in
5. Burn-in Elimination
6. Estimation of Junction Temperature Increase
with Technology Scaling under Burn-in Conditions
7. Packaging Consideration in Bum-in
8. Cooling Techniques for Burn-in
9. Bum-in Limitations and Optimization
10.  Summary
Chapter 4. Thermal and Electrothermal Modeling
1. Objectives of Thermal Analysis
2. Thermal Network Modeling
3. Architectural Level Electrothermal Modeling
4. Electrothermal Modeling at Logic Level
5. Electrothermal Modeling at Circuit Level
6. Electrothermal Modeling at Device Level
7. Static Electrothermal Modeling: A Case Study
8. Summary
Chapter 5. Thermal Runaway and Thermal Management
1. Thermal Awareness
2. Thermal Runaway
3. Thermal Runaway During Burn-in
4. Thermal Management during
Normal Operating Conditions
5. Temperature Management: A Case Study
6. Temperature Measurement of Semiconductor Devices
7. Summary
Chapter 6. Low Temperature CMOS Operation
1. Low Temperature Motivation
2. Low Temperature Characterization of CMOS Devices
3. Reliability at Low  Temperature
4. Microprocessor Low Temperature Operation :  A Case Study
5. Disadvantages of Low Temperature Electronic Cooling
6. Cooling Technologies
7. Summary
Index

giuhertzniu

非常感谢

过路心客

good book!谢谢楼主

rickyhuang

ddddddddddd

mtwumtwu

good reference for IC design

qptom

thanks!

linyuanfei

zying

Thanks

sunzhang

good book.

lujunfeng111

这么专业的功耗分析的书，真是难得。