在线咨询
eetop公众号 创芯大讲堂 创芯人才网
切换到宽版

EETOP 创芯网论坛 (原名:电子顶级开发网)

手机号码,快捷登录

手机号码,快捷登录

找回密码

  登录   注册  

快捷导航
搜帖子
查看: 4818|回复: 15

[资料] 只发经典:High-Speed VLSI Interconnections【2008,Wiley-IEEE Press】

[复制链接]
发表于 2014-1-20 15:59:02 | 显示全部楼层 |阅读模式

马上注册,结交更多好友,享用更多功能,让你轻松玩转社区。

您需要 登录 才可以下载或查看,没有账号?注册

x
本帖最后由 echoas 于 2014-1-20 16:02 编辑

Note: This Book was published in 2008. NOT A New BOOK!!!!
Abstract: From Wiley-IEEE Press.


Cover.png    

Author(s): Ashok K. Goel
Published Online: 22 JAN 2007
Print ISBN: 9780471780465
Online ISBN: 9780470165973
DOI: 10.1002/9780470165973
=================================================================


This Second Edition focuses on emerging topics and             advances in the field of VLSI interconnections

             In the decade since High-Speed VLSI Interconnections was             first published, several major developments have taken place             in the field. Now, updated to reflect these advancements,             this Second Edition includes new information on copper             interconnections, nanotechnology circuit interconnects,             electromigration in the copper interconnections, parasitic             inductances, and RLC models for comprehensive analysis of             interconnection delays and crosstalk.

             Each chapter is designed to exist independently or as a part             of one coherent unit, and several appropriate exercises are             provided at the end of each chapter, challenging the reader             to gain further insight into the contents being discussed.             Chapter subjects include:
             *

             Preliminary Concepts
             *

             Parasitic Resistances, Capacitances, and Inductances
             *

             Interconnection Delays
             *

             Crosstalk Analysis
             *

             Electromigration-Induced Failure Analysis
             *

             Future Interconnections

             High-Speed VLSI Interconnections, Second Edition is an             indispensable reference for high-speed VLSI designers, RF             circuit designers, and advanced students of electrical             engineering.
=================================================================


Contents:1 Preliminary Concepts and More 1
1.1 Interconnections for VLSI Applications 2
1.2 Copper Interconnections 5
1.3 Method of Images 10
1.4 Method of Moments 15
1.5 Even- and Odd-Mode Capacitances 17
1.5.1 Two Coupled Conductors 17
1.5.2 Three Coupled Conductors 19
1.6 Transmission Line Equations 21
1.7 Miller’s Theorem 23
1.8 Inverse Laplace Transformation 25
1.9 Resistive Interconnection as Ladder Network 27
1.10 Propagation Modes in Microstrip Interconnection 31
1.11 Slow-Wave Mode Propagation 32
1.12 Propagation Delays 41

2 Parasitic Resistances, Capacitances, and Inductances 46
2.1 Parasitic Resistances: General Considerations 47
2.2 Parasitic Capacitances: General Considerations 50
2.3 Parasitic Inductances: General Considerations 52
2.4 Approximate Formulas for Capacitances 57
2.5 Green’s Function Method: Using Method of Images 60
2.6 Green’s Function Method: Fourier Integral Approach 84
2.7 Network Analog Method 91
2.8 Simplified Formulas for Interconnection Capacitances
2.9 Inductance Extraction Using FastHenry 114
2.10 Copper Interconnections: Resistance Modeling 119
2.11 Electrode Capacitances in GaAs MESFET:

4 Crosstalk Analysis 242
4.1 Lumped-Capacitance Approximation 243
4.2 Coupled Multiconductor MIS Microstripline Model of Single-Level Interconnections 245
4.3 Frequency-Domain Modal Analysis of Single-Level Interconnections 253
4.4 Transmission Line Analysis of Parallel Multilevel Interconnections 264
4.5 Analysis of Crossing Interconnections 280
4.6 Compact Expressions for Crosstalk Analysis 293
4.7 Multiconductor Buses in GaAs High-Speed

5 Electromigration-Induced Failure Analysis 313
5.1 Electromigration in VLSI Interconnection Metallizations: Overview 314
5.2 Models of IC Reliability 328
5.3 Modeling of Electromigration Due to Repetitive Pulsed Currents 331
5.4 Electromigration in Copper Interconnections 341
5.5 Failure Analysis of VLSI Interconnection Components 344
5.6 Computer-Aided Failure Analysis 356

6 Future Interconnections 371
6.1 Optical Interconnections 371
6.2 Transmission Line Models of Lossy Optical Waveguide Interconnections 375
6.3 Superconducting Interconnections 386
6.4 Nanotechnology Circuit Interconnections: Potential Technologies 390

INDEX 405


High-Speed VLSI Interconnections[2008,Wiley-IEEE Press].pdf (11.59 MB, 下载次数: 379 )

发表于 2014-1-20 17:06:58 | 显示全部楼层
queshi
发表于 2014-1-23 08:26:48 | 显示全部楼层
Posted before ?
发表于 2014-1-25 13:56:46 | 显示全部楼层
多谢楼主
 楼主| 发表于 2014-2-12 22:31:06 | 显示全部楼层
回复 3# pupukid


    No, You can search it in eetop!
发表于 2014-4-28 00:08:46 | 显示全部楼层
下載參考看看
发表于 2014-4-28 00:25:03 | 显示全部楼层
好东西。!!!!!!!!!!!!!!!!!!!
发表于 2014-10-6 22:44:12 | 显示全部楼层
谢谢楼主分享!
发表于 2016-3-8 10:15:58 | 显示全部楼层
感谢分享
发表于 2016-7-28 20:34:39 | 显示全部楼层
thanks!
您需要登录后才可以回帖 登录 | 注册

本版积分规则

关闭

站长推荐 上一条 /2 下一条

×

小黑屋| 手机版| 关于我们| 联系我们| 在线咨询| 隐私声明| EETOP 创芯网
( 京ICP备:10050787号 京公网安备:11010502037710 )

GMT+8, 2024-12-23 23:07 , Processed in 0.025186 second(s), 10 queries , Gzip On, Redis On.

eetop公众号 创芯大讲堂 创芯人才网
快速回复 返回顶部 返回列表