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本帖最后由 echoas 于 2014-1-20 16:02 编辑
Note: This Book was published in 2008. NOT A New BOOK!!!!
Abstract: From Wiley-IEEE Press.
Author(s): Ashok K. Goel
Published Online: 22 JAN 2007
Print ISBN: 9780471780465
Online ISBN: 9780470165973
DOI: 10.1002/9780470165973
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This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections
In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.
Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:
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Preliminary Concepts
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Parasitic Resistances, Capacitances, and Inductances
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Interconnection Delays
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Crosstalk Analysis
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Electromigration-Induced Failure Analysis
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Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
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Contents:1 Preliminary Concepts and More 1
1.1 Interconnections for VLSI Applications 2
1.2 Copper Interconnections 5
1.3 Method of Images 10
1.4 Method of Moments 15
1.5 Even- and Odd-Mode Capacitances 17
1.5.1 Two Coupled Conductors 17
1.5.2 Three Coupled Conductors 19
1.6 Transmission Line Equations 21
1.7 Miller’s Theorem 23
1.8 Inverse Laplace Transformation 25
1.9 Resistive Interconnection as Ladder Network 27
1.10 Propagation Modes in Microstrip Interconnection 31
1.11 Slow-Wave Mode Propagation 32
1.12 Propagation Delays 41
2 Parasitic Resistances, Capacitances, and Inductances 46
2.1 Parasitic Resistances: General Considerations 47
2.2 Parasitic Capacitances: General Considerations 50
2.3 Parasitic Inductances: General Considerations 52
2.4 Approximate Formulas for Capacitances 57
2.5 Green’s Function Method: Using Method of Images 60
2.6 Green’s Function Method: Fourier Integral Approach 84
2.7 Network Analog Method 91
2.8 Simplified Formulas for Interconnection Capacitances
2.9 Inductance Extraction Using FastHenry 114
2.10 Copper Interconnections: Resistance Modeling 119
2.11 Electrode Capacitances in GaAs MESFET:
4 Crosstalk Analysis 242
4.1 Lumped-Capacitance Approximation 243
4.2 Coupled Multiconductor MIS Microstripline Model of Single-Level Interconnections 245
4.3 Frequency-Domain Modal Analysis of Single-Level Interconnections 253
4.4 Transmission Line Analysis of Parallel Multilevel Interconnections 264
4.5 Analysis of Crossing Interconnections 280
4.6 Compact Expressions for Crosstalk Analysis 293
4.7 Multiconductor Buses in GaAs High-Speed
5 Electromigration-Induced Failure Analysis 313
5.1 Electromigration in VLSI Interconnection Metallizations: Overview 314
5.2 Models of IC Reliability 328
5.3 Modeling of Electromigration Due to Repetitive Pulsed Currents 331
5.4 Electromigration in Copper Interconnections 341
5.5 Failure Analysis of VLSI Interconnection Components 344
5.6 Computer-Aided Failure Analysis 356
6 Future Interconnections 371
6.1 Optical Interconnections 371
6.2 Transmission Line Models of Lossy Optical Waveguide Interconnections 375
6.3 Superconducting Interconnections 386
6.4 Nanotechnology Circuit Interconnections: Potential Technologies 390
INDEX 405
High-Speed VLSI Interconnections[2008,Wiley-IEEE Press].pdf
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发表于 2014-1-20 15:59:02
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