TSMCN40的wire bond DRC可以waive吗

zzw_2000

如图，使用的是TSMC CUP wire bond staggered IO PAD，在做CN45_WIRE_BOND_8M_5X1Z1U.15a的DRC的时候，遇到两个violation，请问可以waive吗？或者请问有没有用过相关工艺的前辈们告诉一下如何解决呢？

Check CB.EN.1  cell PAD60GU 和 PAD60NU

CB.EN.1 { @ CB enclosure by CB2_WB == 0 um
  CBx XOR CB2
}

weodong

看起来不太行，RELEASE NOTE里有：
a. The following DRC violations for wire bond pads could be waived in cell-level.
 CB2.EN.1:ST_M1(in PAD60N, PAD70N)
 CB2.EN.1:ST_M2(in PAD60N, PAD70N)
 CB2.EN.1:ST_M3(in PAD60N, PAD70N)
 CB2VIA1.R.3:OUTER(in PAD60N)
 CB2VIA2.R.3:OUTER(in PAD60N)
 CB2VIA3.R.3:OUTER(in PAD60N)
 AP.DN.1.1(in PAD50GAU_SL, PAD50GU_SL, PAD50NAU_SL, PAD50NU_SL,
PAD60GAU_SL, PAD60GU, PAD60GU_SL, PAD60N, PAD60NA, PAD60NAR,
PAD60NAU_SL, PAD60NU, PAD60NU_SL, PAD70GU, PAD70N)