ISSCC 2024 Digest 论文分章节

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1 Plenary.........................................................................................8
2 Processors and Communication SoCs......................................34
3 Analog Techniques.....................................................................52
4 High Performance Transceivers and Transmitters for................74
Communication and Ranging
5 Wireless RF and mm-Wave Receiver Techniques......................86
6 Imagers and Ultrasound.............................................................98
7 Ultra-High-Speed Wireline........................................................122
8 Hybrid DC-DC Converters........................................................142
9 Noise-Shaping and SAR ADCs..................................................166
10 Frequency Synthesis................................................................186
11 Industry Invited Highlighted Chip Releases: Digital and Machine Learning Processors
.......................................................................206
12 Electromagnetic Interface ICs for Information and Power........216
13 High-Density Memory and Interfaces.......................................230
14 Digital Techniques for System Adaptation,...............................252
     Power Management and Clocking
15 Embedded Memories & Ising Computing................................274
16 Security: From Processors to Circuits......................................294
17 Emerging Sensing and Computing Technologies.....................312
18 High-Performance Optical Transceivers...................................336
19 RF to mm-Wave Oscillators and Multipliers..............................346
20 Machine Learning Accelerators................................................358
21 Audio Amplifiers.......................................................................376
22 High-Speed Analog-to-Digital Converters.................................386
23 Energy-Efficient Connectivity Radios........................................398
24 D-Band/Sub-THz Transmitters and Sensors.............................410
25 Invited: Innovations from Outside the (ISSCC’s) Box...............420
26 Display and User Interaction Technologies............................430
27 Wireless Power.........................................................................442
28 High-Density Power Management............................................454
29 ICs for Quantum Technologies.................................................468
30 Domain-Specific Computing and Digital Accelerators..............480
31 Power Converter Techniques....................................................494
32 Power Amplification and Signal Generation..............................518
33 Intelligent Neural Interfaces and Sensing Systems..................540
34 Compute-In-Memory................................................................564

ken12341

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