Hybrid bonding 将Cu-Cu bonding 和 Anneal 温度降低到200度左右么？

tencome

请问一下大神们， 业内有其它解决方案么？可以将Cu-Cu bonding  和 Anneal 温度降低到200度左右么？


Hybrid bonding examples and materials. (a) Cu/BCB hybrid bonding, where BCB-BCB is bonded at lower temperature (~250C), followed by raising the temperature above 350C for Cu-Cu bonding. (b) and (c) Cu/PECVD oxide hybrid bonding, where pre-bonding is done at room temperature and the permanent bond is formed during the post-bond anneal at above 350C. A ~4 nm thick CuO x crystalline layer is present before the post-bonding anneal.

xieye1986520

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Lisa_3dmic

HB是常温工艺，之后的退火温度和时间是有一个关系的，控制得好200度电性是没有问题的。