Understanding Fabless IC Technology

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登录/注册后可看大图 By Jeorge Hurtarte Evert Wolsheimer Lisa Tafoya, Fabless Semiconductor Association Description Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. ?Fabless? ICs are those designed and marketed by one company but actually manufactured by another. Audience IC engineers, design engineers (analog and digital), engineering management. Contents PART 1 – Manufacturing Strategies: Understanding Fabless IC Technology Chapter 1: More than a Decade of Transition in the Semiconductor Industry 1.1 FSA is Established 1.2 Early Success 1.3 Early Success Trend Continues 1.4 Semiconductor Business Models 1.5 Outsourcing Will Accelerate 1.6 IDMs are Going Fabless 1.7 A Case Study: Cypress Semiconductor 1.8 More IDMs are Outsourcing 1.9 Geographic Manufacturing Centers Chapter 2: Fabless Semiconductor Manufacturing 2.1 Foundry Revenue Growth 2.2 Semiconductor Back-End Services 2.3 Semiconductor Equipment Chapter 3: Qualities of Successful Fabless Companies 3.1 Defining Events for the Fabless Market 3.2 Thriving in the Fabless Model 3.3 Key Qualities for Success 3.4 The Future of Fabless PART 2 – An In-Depth Understanding of the Fabless Semiconductor Business Model Chapter 4: Semiconductor Manufacturing Basics 4.1 Semiconductor Processes 4.2 Semiconductor Manufacturing Steps 4.3 Wafer Size 4.4 Manufacturing Costs 4.5 Conclusion Chapter 5: Fabless ASICs 2.1 Introduction 5.2 Origins of the ASIC Industry 5.3 Emergence of the Fabless ASIC Business Model 5.4 The Fabless ASIC Model: How It Works 5.5 The Services and Capabilities of a Fabless ASIC Supplier 5.6 Conclusion Chapter 6: Electronic Design Automation 6.1 Fabless EDA Overview 6.2 Fabless EDA Selection Process 6.3 Physical Design EDA Chapter 7: Intellectual Property 7.1 SIP Industry Overview 7.2 SIP Business Environment 7.3 Sourcing Industry Overview 7.4 Baseline Terminology 7.5 Finding SIP and Related Products 7.6 Evaluating SIP Business Models 7.7 SIP Product Enablers 7.8 Examples by SIP Product Type 7.9 Licensing SIP Products 7.10 Provider and Buyer Perspectives 7.11 The Evolution of the IP Industry 7.12 Intellectual Property Considerations 7.13 IP Outsourcing 7.14 Making IP Work in the Fabless Semiconductor Community 7.15 IP Acquisition Considerations for Fabless IC Companies Chapter 8: e- Commerce 8.1 The Virtual Fab Challenge 8.2 Semiconductor & Fabless Manufacturing: What is Different? 8.3 ?Build to Forecast? for Outsourced Manufacturing 8.4 ERP System Solutions 8.5 The Information Ecosystem: Where Communication is Key Chapter 9: Quality and Reliability 9.1 General 9.2 Front- End 9.3 Back-End 9.4 Environment, Health and Safety Chapter 10: Test Development 10.1 Simplifying Outsourced Test Development 10.2 Preparations 10.3 Evaluation 10.4 Conclusion PART 3 – Becoming a Best-in-Class Fabless Company Chapter 11: Best Practices for Fabless Companies 11.1 Achieving Best-in-Class Operations Practices 11.2 A Foundry Manager?s Role in a Fabless Company 11.3 Closing the Loop: Understanding the Manufacturing Flow 11.4 Managing a Virtual Manufacturing Chain Chapter 12: Building the Right Partnerships 12.1 Suppliers are (Almost) Just as Important as Customers 12.2 Operations in a Fabless Start-Up 12.3 Legal Issues for Fabless Semiconductor Companies 12.4 Semiconductor Back-End Subcontracting: No Longer a Zero-Sum Game Chapter 13: Building the Right Relationships with the board and VCs 13.1 Creating Successful Corporate Boards in Fabless Companies 13.2 Finding the Right VC PART 4- The Fabless Business Model: A Look into the Future Chapter 14: Perspectives in the Future of Fabless 14.1 Keeping Up with the Pace of Change in a Fabless World 14.2 Foundry Roadmaps: Partnering, Leading and Innovating 14.3 Semiconductor Manufacturing in the 21st Century 14.4 The Emerging Dominance of China in the Technology and End Markets Bibliographic & ordering Information Paperback, 296 pages, publication date: AUG-2007 ISBN-13: 978-0-7506-7944-2 ISBN-10: 0-7506-7944-1 Imprint: NEWNES Price: Order form USD 69.95 GBP 39.99 EUR 57.95

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