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Adjacent wire minimum space requirement 25 BCB...................................................................... 4 Bond target location(s) on lead (terminal)requirements 26 Bondpad dimensional requirements for APG 10 Bondpad Dimensional Requirements for Die to Die Wirebonding 12 Bondpad Dimensional Requirements for Discretes 10 Bondpad fillet defined....................................... 4 Bondpad Layout DimensionalRequirements 10 Bondpad metal layerconstruction requirements 6 Bondpad passivation opening to seal ring.... 8 Bondpad passivation opening to unrelated metal minimum clearance 8 Bondpad pitch definition.................................. 4 Bondpad Placement........................................ 7 BSOB................................................................... 4 Buildsheet Requirements.............................. 34 Corner Exclusion Rule................................... 15 DAP...................................................................... 4 DAP edge distance to center of downbond or substratebond 27 Definitions and notes........................................ 4 Die Attach Paddle.............................................. 4 Die edge defined............................................... 4 Die edge to DAP edge minimum clearances 29 Die ID................................................................... 4 Die Identification/Step CodeRequirements 19 Die Placement Rules..................................... 29 Die rotation on DAP or die attach area........ 31 die size how to measure........................................... 19 Die size Prescribed increments................................ 19 Die size defined................................................. 4 Die Size Requirements................................. 19 Die to die gap for multiple die on single DAP, epoxydie attach 30 Die to die gap, Discrete’s assembly requirements 30 Discretes........................................................... 30 Downbond defined............................................ 4 Dual row bondpad option................................. 9 Fine Pitch defined............................................. 4 Fine Pitch note on buildsheets..................... 34 Graffiti.................................................................. 4 Ground bond.................... See Substrate Bond Kelvin pad orientation..................................... 14 Kelvin Sense Pad defined............................... 4 Kelvin, trim, or zap padrequirements....... 13 Lead bond on the terminal min distance to edge 26 List of Figures................................................... 35 List of Tables.................................................... 34 Master and Option ID requirements............. 19 Master ID............................................................. 4 Maximum inboard bondpad............................. 7 Maximum wire formula for multiple bonds on terminalsor leads 33 Maximum wirelength over the die................. 20 Maximum wires per leadtip (terminal) width 26 Microprobe test padpassivation openings 15 Minimum adjacent wire to wire spacing requirement forsubstrate bond 28 Minimum bondpad metal enclosure of bondpad passivation 13 Minimum seal ring width................................ 16 MLP...................................................................... 4 Option ID............................................................. 5 PADGEN RULESET and CAD DRCSummary 40 parallel bondpads.............................................. 9 Passivation overlap requirement.................. 16 pin one bondpad requirements................. 15 PITCH CAPABILITY BYwire/PACKAGE TYPE 39 Purpose............................................................... 2 Saw street......................................................... 18 Saw street defined............................................. 5 Saw street passivation opening.................... 16 Saw Street Requirements............................ 18 Scope................................................................... 2 Seal Ring ConstructionRequirements forAPG Products 16 Seal ring defined............................................... 5 Seal ring metal width...................................... 16 Section 8 values summary spreadsheet..... 31 Staggered bondpads......................................... 9 Substrate Bond Defined................................... 5 Tiebar defined.................................................... 5 Wafer level CSP layout rules......................... 6 wire diameter.................................................... 33 Wire length die to lead, by package type and wirediameter 20 Wire length measurement.............................. 20 Wire space defined............................................ 5 Wire to adjacent leadtip minimum clearance requirement 25 Wirebond Related Rules.............................. 20 Wirebond target requirements for substrate bond ordownbond 27 Wirebond target requirements for wirebond to DAP orsubstrate die attach area 27 Wirebonding to tiebar...................................... 27 Worked loop wirebond defined....................... 5
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发表于 2021-9-17 09:20:52
