[Springer 2011] Advanced Materials for Thermal Management of Electronic Packaging

lsw0908

Advanced Materials for Thermal Management of Electronic Packaging

edited by Xingcun Colin Tong

The need for advanced thermal management materials in electronic packaging has
been widely recognized as thermal challenges became barriers to the electronic
industry’s ability to provide continued improvements in device and system perfor-
mance. With increased performance requirements for smaller, more capable, and
more efficient electronic power devices, systems ranging from active electronically
scanned radar arrays to web servers all require components that can dissipate heat
efficiently. This requires that the materials have a high capability for dissipating
heat and maintaining compatibility with the die and electronic packaging. In
response to these critical needs, revolutionary advances in thermal management
materials and technologies for active and passive cooling now promise integrable
and cost-effective thermal management solutions. As a result, a large number of
papers, articles, and presentations have been published on the development of high-
performance materials to solve the vexing problem of device and package-level
cooling and thermal management.However, no comprehensive and accessible book
has been available on this topic for students, materials scientists, and electronics
engineers.
To meet this need, Advanced Materials for Thermal Management of Electronics
Packagingtakesa systems approachranging from thermalmanagement fundamentals
to a balance between cost and performance in materials selection and assessment.

jasonbomy

thanks ~ it's useful

joshuacp

Good.

xuleiwx

收藏一下

lhyi

Thanks

alter_chen

多谢分享

reptilian77

useful book

reptilian77

thank you

reptilian77

more books from eda world

kldeng1344

Good la