EDICON2019 prensentaion&papers

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ALL PRESENTATIONS & PAPERS:
All Presentations & Papers from EDI CON CHINA 2019 are here

     
Plenary Keynote:
     Sandler, Steve. Power Related Considerations in RF, Microwave and High Speed Circuits (Presentation)

     Pabst, Alexander. 5G New Radio Test & Measurement Challenges and How to Address Them (Presentation)

   
  
5G/Advanced Communications:
66_Li, Cong. Antenna in Package Design for mm-wave and Efficient Method (Presentation)

    76_Theeuwen, Steven. LDMOS Technology for 5 GHz Power Amplifiers (Presentation)

   
76_Theeuwen, Steven. LDMOS Technology for 5 GHz Power Amplifiers (Paper)

   
54_Lappalainen, Joni. Beamforming and Total System Efficiency Optimization of Poorly Isolated Antenna Arrays (Presentation)

   
42_Yu, Ting. Summary of Linearity Evaluation Scheme of Load Pull Technology for 5G Ampifier Design (Presentation)


    84_Reshef, Gilad. Next-Generation Additive Electronics Precise Multi Material Deposition for Circuits, Electro Mechanical Parts and RF Antennas (Presentation)
   

    40_Lin, Jimmy. Challenges for Effective and Realistic 5G OTA Testing (Presentation)


   

  
Power Integrity:
  105_D'Aquino, Andrea. Power Distribution Network Testing through Impedance Analysis (Presentation)

  105_D'Aquino, Andrea. Power Distribution Network Testing through Impedance Analysis (Paper)

      
51_Pandey, Anil. Signal and Power Integrity Analysis of DDR4 Address Bus of Onboard Memory Module (Presentation)

   
21_Liqiang, Meng et al. How to Design a Reliable Power Distribution Network Through Chip Package PCB Co-Design (Presentation)

  
90_Sandler, Steve. New and Upcoming Power Related Challenges (Presentation)

  
103_Li, Baolong. Modeling and Probing for Accurate PDN Impedance Measurements in sub-Kilohertz Range (Presentation)

  83_Chang, Michael. Low-power SERDES Transceiver for Supply-Induced Jitter Sensitivity (Presentation)

  


Simulation & Modeling:
  91_Van Der Klooster, Lars. Advances in Recent PCB Design Verification Flows (Presentation)

  33_Xiao, Dingru. Accurately Modeling an Advanced IC Package for Chip-Package-Board Electrical-Thermal Co-Simulation (Presentation)

  
33_Xiao, Dingru. Accurately Modeling an Advanced IC Package for Chip-Package-Board Electrical-Thermal Co-Simulation (Paper)

  
50_Jiang, Liang. Co-Design of RF Chips and Modules for RF Solution (Presentation)

  59_SIMBELIE, Frederique. GaN HEMTS Device Modeling using ASM Standard-Extraction Flow and Validation (Presentation)

  
32_Wu, Jun. High Speed Structure Optimizer Flow Introduction (Presentation)
  
85_Shah, Jay et al_Extracting Accurate Transmission Line Losses by Incorporating Localized Temperature Variation Effects for High Speed Boards (Presentation)

  45_Ouardirhi, Zacharia. Wideband Behavioral Modeling of Nonlinear RF Blocks with Frequency Transposition and Memory Effects (Presentation)

   

   

  
Test & Measurement:
  119_Loerner, Markus. Improve Doherty Amplifier in Efficiency and Output Power (Presentation)

  119_Loerner, Markus. Improve Doherty Amplifier in Efficiency and Output Power (Paper)

  
117_Loerner, Markus. Beamforming Measurements (Presentation)

  
117_Loerner, Markus. Beamforming Measurements (Paper)
  
  118_Loerner, Markus. Antenna-in-Package Design, Where are my Connectors From Conducted to OTA (Presentation)

  118_Loerner, Markus. Antenna-in-Package Design, Where are my Connectors From Conducted to OTA (Paper)

  115_Bednorz, Thilo. Near-field Measurements on Antennas with internal LO (Presentation)

  114_Bednorz, Thilo. Measurement Accuracy of Vector Network Analysis (Presentation)

  111_Naehring, Alexander. Introduction to Over-the-Air Measurements, Chamber and Test Setup Calibration (Presentation)

  111_Naehring, Alexander. Introduction to Over-the-Air Measurements, Chamber and Test Setup Calibration (Paper)

    16_Lu, Jun. Theory and Implementation of a Precision Lock-In Frequency Meter Institute of Physics (Presentation)

    17_Yu, Tim. Demystifying Noise Parameter Measurements and Model Extraction (Presentation)

    14_Mallette, Vince. Effects of Harmonic and Base-Band Tuning on Linearity (Presentation)

    15_Mallette, Vince. Active Modulated Load Pull (Presentation)

        46_Ouardirhi, Zacharia. Optimization of Microwave Circuit Test Flow and Data Analysis – From Narrowband Detection to DPD Implementation (Presentation)

   


Keysight Education Forum:
Li, Kai. High Performance AI Chip Test (Presentation)


ADS RF and Microwave Design Solutions (Presentation)


New Generation of Comprehensive Test and Automated Test Solutions for Radio (Presentation)


   

mmWave:
  72_Feng, Xiang. Addressing Test Challenges of 802.11ay Technology (Presentation)

  52_Hong Ng, Guan. Design of an Integrated mmWave Phase Array Antenna Structure with RF-Front End for 5G (Presentation)

   

5G/RF Design:
  36_Stackler, Marc. Synchronizing High-Speed Data Converters and Digitizers: The Benefit of Daisy Chaining (Presentation)

  96_Xuyao, Sun. Hybrid Precoding Design for Multiuser Millimeter Wave Massive MIMO Systems with Finite Resolution Phase Shifters (Presentation)

  
96_Xuyao, Sun. Hybrid Precoding Design for Multiuser Millimeter Wave Massive MIMO Systems with Finite Resolution Phase Shifters (Paper)

  
69_Jiaming, Bi. The Research of Millimetre Microstrip Conformal Phased Array (Presentation)

  
69_Jiaming, Bi. The Research of Millimetre Microstrip Conformal Phased Array (Paper)

  


Amplifier Design:
  35_Huang, Fei. A Broadband High-Efficiency Fully Integrated C-band Doherty Power Amplifier MMIC for 5G MIMO application (Presentation)

    116_Ramian, Florian. Model Derivation from Direct DPD (Presentation)

   
116_Ramian, Florian. Model Derivation from Direct DPD (Paper)

  
27_Zhao, Junlei. High Efficient and Wideband Linear PA Design for 5G mm-wave Communications (Presentation)
      


Low Power/IoT:
  67_Shao, Hui. Traceable RFID Tag Performance Measurements (Presentation)
  
  
  

Signal Integrity:
  44_Arjun Huddar,Vinod. Ground Bounce on Broadside Coupled Signals in High Density SSD (Presentation)

  43_Ying, Zhang. 56Gbs 4-Pulse Amplitude Modulation Signal Integrity Design Key Points (Presentation)

  
110_Hongfei, Xu. RF Test on PCB High Speed Cables (Presentation)

  58_Zhao, Zhenwei. PCB Stackup Design Skew Effect (Presentation)

  


Front End Design:
  112_Bednorz, Thilo. Characterize Pulse Recovery Time and Behavior of LNAs and RF Front-Ends (Presentation)

  101_Balteanu, Florinel. Linear Front-End Module for 4G5G Advanced Applications (Presentation)

  92_Dourado, Fabrício. Better Amplifier or RF Front-End Design Decisions Improve Your RF Test Work Flow (Presentation)

    92_Dourado, Fabrício. Better Amplifier or RF Front-End Design Decisions Improve Your RF Test Work Flow (Paper)

   

RF/MW Design:
  60_Fu, Lihua. Design and Optimization of Plane Microstrip Fractal Antenna Based on Y Structure_1 (Presentation)

  60_Fu, Lihua. Design and Optimization of Plane Microstrip Fractal Antenna Based on Y Structure_2 (Presentation)

  
60_Fu, Lihua. Design and Optimization of Plane Microstrip Fractal Antenna Based on Y Structure_2 (Paper)

  
Van Der Klooster, Lars. Utilizing Network Synthesis to Accelerate Matching Circuit Design (Presentation)

  37_Dunn, Mark. RF GaN Modeling for 5G and Other Applications (Presentation)

   
  


Frequency Matters Theater:
  Acar, Erkan. Achieving Ultra Low EVM through Signal Chain Optimization (Presentation)

  Zhang, Cemin. Multi-Channel Phase Calibration Method for 5G Phased Array System (Presentation)

  Chang, Michael. System-level Mobile device for radio frequency interference analysis (Presentation)

    Jiaming, Bi. Analysis and research of sigrity integrity in the DDR Full link simulation (Presentation)

     Jiaming, Bi. Analysis and research of sigrity integrity in the DDR Full link simulation (Paper)

     Loerner, Markus. Components for 5G – what is new (Presentation)

      Loerner, Markus. Components for 5G – what is new (Paper)

       Wu, Bruce. High Speed SerDes Bus Design and Simulation (Presentation)

        Ouardirhi, Zacharia. Systematic Large Signal Stability Analysis technique for multi-transistor RF Circuit (Presentation)

        Olsen, Erick. Advances in High Frequency Packaging (Presentation)

   

Workshops:
  Rohde & Schwarz. Modern Techniques to characterize Phase and Group Delay of Frequency Converters (Presentation)

  Infinite Technologies. Assist to RF R&D, Helping RF Engineers Out of A Dilemma (Presentation)

  Rohde & Schwarz. Clock and LO Architectures in 5G Base Stations (Presentation)

  Teledyne LeCroy. How Different FPGA Firmware Options Enable Digitizer Platforms to Address and Facilitate Multiple Applications (Presentation)

  NI, AWR Groups. Designing a Narrowband 28-GHz Bandpass Filter for 5G (Presentation)

   OMMIC. 100nm and 60 GaN/Si MMICs: The optimum complement to Si MMICs for mmW and TeraHertz applications (Presentation)

  AWR Group of NI. A Pole-Site Small-Cell Beamforming Module For 5G (Presentation)

  Prosund Technology. The Evolution of Measuring Method: From Analog T/R Module to 5G RF Front-End Module (Presentation)

  GaAs MMIC Localization (Presentation)

  UniCompound. Self-Property Compound Semiconductor RFIC Manufacturing Services in China (Presentation)

  Speed Wireless Technology. 5G Millimeter-Wave Active Antenna Unit Designs (Presentation)

  Analog Devices. Radio Solutions to Enable 5G MIMO and Small Cell (Presentation)

  Anokiwave, Inc. All Silicon Active Antennas for High Performance and Low-Cost mmWave Systems (Presentation)

  NXP. 5G Small Cells The evolution of system architecture and its impact on component development (Presentation)

  Washington Laboratories &American Certification Body. Narrowband Spectrum Techniques for Enabling IoT Expansion (Presentation)

  OMMIC. 100nm GaN on Si Technology for mmW 5G Application and SATCOM (Presentation)

  Mini-Circuits. Microwave and mmW Products to 50 GHz (Presentation)

  Short Course_NI/AWR, Rohde & Schwarz, RichardsonRFPD. Antenna Boosters for IoT Devices (Presentation)

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