【新书】3D Integration in VLSI Circuits：Implementation Technologies and

hsh22 · 发表于 2018-8-16 00:49:56

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3D Integration in VLSI Circuits：Implementation Technologies and Applications

3D Integration in VLSI Circuits：Implementation Technologies.part1.rar (14.31 MB, 下载次数: 364 )

3D Integration in VLSI Circuits：Implementation Technologies.part2.rar (14.31 MB, 下载次数: 361 )

3D Integration in VLSI Circuits：Implementation Technologies.part3.rar (129.23 KB, 下载次数: 219 )

3D Integration in VLSI.jpg

More and more products are using three-dimensional (3D) integration technology nowadays. Through-silicon vias (TSVs) have been used in high bandwidth memory (HBM) modules and will become mainstream for other high-end products such as graphics processing units (GPU) and highperformance computing (HPC), with applications in databases, ecurity, computational biology, molecular dynamics, deep learning, and automotive. There is no doubt that 3D integration is gaining a signifcant attention as a promising means to improve performance as it can provide higher interconnect speeds, greater bandwidth, increased functionality, higher capacity, and lower power dissipation.

lhyi · 发表于 2018-8-16 01:18:10

Kan e kan

trash_net · 发表于 2018-8-16 03:50:55

謝謝分享

xuleiwx · 发表于 2018-8-16 11:32:04

是2018年的新书

alter_chen · 发表于 2018-8-16 11:41:33

谢谢分享

apteye · 发表于 2018-8-16 12:48:52

多谢！downmark

alenanderson · 发表于 2018-8-16 14:10:53

謝謝分享

ben. · 发表于 2018-8-16 14:19:47

thanks

ben. · 发表于 2018-8-16 14:20:25

thansk

mingli1110 · 发表于 2018-8-16 16:55:04

谢谢下载了看看，新书啊

[资料] 【新书】3D Integration in VLSI Circuits：Implementation Technologies and

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