AMD is looking for physical design engineer of multiple levels in Beijing

RecruiterAMD

Position: ASIC PhysicalDesign Engineer – multiple levels, Beijing

Role &Responsibilities:

Work with global Front-End design team and physical designteam for large scale ASIC chip physical implementation. Focus on physicaldesign of deep sub-micron GPU chipsincluding block level (full chip) floor planning, timing closure, place &route, physical verification etc. The individual is expected to be an expert inmultiple aspects in PD areas and provide technically leadership to theengineering team. The individual is also expected to be accountable for projectdelivery.

Job Requirements:

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MSEE or Bachelor with 3 – 20 of industrialexperience in ASIC physical design

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Experience in physical design of deep submicrondigital ASIC chips

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Hands on experience in large scale ASIC chipphysical design

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Knowledgeable in all aspects of deep submicronASIC design flow

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Successfully gone through several completeproduct development cycles

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Demonstrate strong leadership and work well withcross-functional teams

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Good listening, writing and speaking English

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Good communication skills, strong interpersonalskills and the flexibility

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Dedicated, hardworking and good team player

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Familiar with Back-End (physical design) EDAtools

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Familiar with Front-End EDA tools is a plus

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Familiar with Unix/Linux environment and good atscripts

How to Apply?

E-mail to [url=]zhi.lin@amd.com[/url]to inquire details or apply for the position or add wechat via linzhihere