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[招聘] AMD超威半导体热招PD engineer后端设计岗位

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发表于 2017-3-24 17:03:49 | 显示全部楼层 |阅读模式

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MTS/SMTS/PMTS Physical Design Engineer

地点上海

请有意者发送简历至Nina.Zhang@amd.comCiela.Wang@amd.com

注明应聘职位


Work with global Front-End design team and physical designteam for large scale ASIC chip physical implementation. Focus on physicaldesign of deep sub-micron GPU chips including block level (full chip) floorplanning, timing closure, place&route, physical verification etc. Theindividual is expected to be an expert in multiple aspects in PD areas andprovide technically leadership to the engineering team. The individual is alsoexpected to be accountable for project delivery.

Job Requirement:

1. MSEE with 8+ years or Bachelor with 10+ years ofindustrial experience in ASIC design

2. 5+ years or more years of experience in physical designof deep submicron digital ASIC chips

3. Demonstrate strong leadership and work well withcross-functional teams

4. Good listening, writing and speaking English

5. Good communication skills, strong interpersonal skillsand the flexibility

6. Familiar with Back-End (physical design) EDA tools andhierarchical fullchip floorplan flow

7. Good at scripts or tcl

8. Plus with 5+ projects tapeout experience

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