cadence 上海 招聘高级客户工程师-RF IC/Package/Board

kengteng

Title: Principal Customer Engagement Engineer -RF IC/Package/Board  
Job location: Shanghai
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Principal Customer Engagement Engineer -RF IC/Package/Board
     
Position Description:
        The primary responsibility is designing, developing, troubleshooting and debugging software programs on Windows/Linux/Unix platforms.
        Will be involved in developing software tools for advanced RF system design platforms.
        The responsibilities also include engaging with customers in understanding their RF system design requirements from chip to package/board and assisting them in adopting Cadence advance RF system design platform.
        The job will also involves presenting and demonstrating relevant Cadence technologies and carrying out product evaluations, workshops, trainings and competitive replacement campaigns.

Position Requirement:
        Strong experience in RF SIP/board design including layout, modeling and simulation.
        Good experience in RF IC design and simulation.
        Experience in RF co-design/simulation from chip to package to board will a big plus.
        Good English verbal and written presentation are must.
         Minimum master degrees in EE or CS.